A method for dismantling soldered components of waste printed circuit boards

A technology of printed circuit boards and electronic components, which is applied in the direction of printed circuits, welding equipment, manufacturing tools, etc., can solve the problems of low component integrity, high risk, high temperature, etc., and achieve easy recycling, high safety, The effect of fast welding

Active Publication Date: 2016-06-22
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this dismantling method has high temperature, low efficiency, high pollution, high risk, and low component integrity rate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] First, clean the waste printed circuit board to remove surface impurities, dry it and place it in a pre-configured acidic solution HBF4 with a concentration of 25%, and add a hydrogen peroxide oxidant with a concentration of 10% to the acidic solution, and then treat the solution. Stir to make it react completely. After the solder on the surface of the printed circuit board is completely dissolved, take out the circuit board and the electronic components at the bottom of the container and rinse them clean. When the desoldering rate of the solution decreases, add hydrogen peroxide oxidant to the solution until the solution Solder is no longer dissolved, at this time the acid solution is replaced and the metal in the waste acid is electrolytically recovered or used as an electroplating solution.

Embodiment 2

[0019] First, the waste printed circuit board is cleaned to remove surface impurities, placed in a pre-configured acidic solution HBF4 with a concentration of 35%, and a hydrogen peroxide oxidant with a concentration of 15% is added to the acidic solution, and then the solution is stirred. After the solder on the surface of the printed circuit board is completely dissolved, take out the circuit board and the electronic components at the bottom of the container and rinse them off. When the desoldering rate of the solution decreases, add hydrogen peroxide oxidant to the solution until the solution is no longer Solder is dissolved, and the acid solution is replaced at this time and the metal in the waste acid is electrolytically recovered or used as an electroplating solution.

Embodiment 3

[0021] First, the waste printed circuit board is cleaned to remove surface impurities, placed in a pre-configured acidic solution HBF4 with a concentration of 50%, and a hydrogen peroxide oxidant with a concentration of 20% is added to the acidic solution, and then the solution is stirred to make After the solder on the surface of the printed circuit board is completely dissolved, take out the circuit board and the electronic components at the bottom of the container and rinse them off. When the desoldering rate of the solution decreases, add hydrogen peroxide oxidant to the solution until the solution is no longer Solder is dissolved, and the acid solution is replaced at this time and the metal in the waste acid is electrolytically recovered or used as an electroplating solution.

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PUM

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Abstract

The invention relates to a method for disassembling welded components of a waste printed circuit board. The method comprises the steps that firstly, the waste printed circuit board is cleaned, impurities on the surface of the waste printed circuit board are removed, drying processing is conducted, then, the waste printed circuit board is placed in an acid solution prepared in advance, hydrogen peroxide oxidizing agents are added into the acid solution, and the solution is stirred to enable the acid solution and the hydrogen peroxide oxidizing agents to react completely; when the sealing-off speed of the acid solution reduces, hydrogen peroxide oxidizing agents are supplemented into the acid solution continuously, after soldering tin on the surface of the printed circuit board is completely dissolved, the circuit board and the electronic components at the bottom of a container are taken out and flushed cleanly, the acid solution is replaced, and metal in the waste acid solution is recovered. The method for disassembling the welded components of the waste printed circuit board is short in dissolving and sealing-off time, environmentally friendly, high in safety and little in pollution; the disassembled byproducts can be recycled and the waste acid solution can be used as an electroplating solution; the defects that in a common printed circuit board disassembling method, energy consumption is high, temperature is high, the treatment capacity is low, pollution is high, the dangerousness is strong and the damaged degree of components is high are effectively overcome.

Description

technical field [0001] The invention relates to a method for dismantling welding components of waste printed circuit boards, and belongs to the technical field of metal environmental protection recovery and utilization. Background technique [0002] Printed circuit boards are the support for the electrical connection of electronic components in electrical products. The value of recycling lies in the reuse of rare and precious metals. However, if the components can be safely removed during disassembly and can continue to be used in other The manufacture of the product, which undoubtedly prolongs the life cycle and saves the cost of recycling. [0003] With the acceleration of the replacement of various electrical products and the arrival of the expiration date, more and more electrical products are eliminated. If these discarded printed circuit boards are discarded, it will cause waste of metal resources and environmental load. However, most of these discarded printed circui...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/018
CPCB23K1/018B23K2101/42
Inventor 关杰
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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