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Magnetron sputtering coating system

A technology of magnetron sputtering coating and sputtering chamber, which is applied in the field of magnetron sputtering and can solve the problems of edge effects and low yield

Active Publication Date: 2016-08-17
WGTECH JIANGXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When using the current magnetron sputtering coating system for coating, the substrate is generally run vertically or tilted at 45 degrees. In this way, the substrate must be fixed with a clamp, resulting in edge effects and low yield.

Method used

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  • Magnetron sputtering coating system
  • Magnetron sputtering coating system
  • Magnetron sputtering coating system

Examples

Experimental program
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Embodiment Construction

[0024] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0025] Please also refer to figure 1 and figure 2 , a magnetron sputtering coating system 200 according to an embodiment, comprising a film feeding chamber 10, a film feeding buffer chamber 20, a film feeding transition chamber 30, a sputtering chamber 40, a film output transition c...

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PUM

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Abstract

The invention discloses a magnetron sputtering coating system, comprising a film intake chamber, a film intake buffer chamber, a film intake transition chamber, a sputtering chamber, a film discharge transition chamber, a film discharge buffer chamber, a film discharge chamber, a substrate rack and seven transmission devices which are separately arranged inside the seven chambers, wherein each transmission device comprises a plurality of transmission shafts which are arranged in parallel, and a plurality of first rubber rings arranged on each transmission shaft in a sleeving manner; the substrate rack comprises a main substrate rack body and a plurality of second rubber rings; the main substrate rack body comprises a frame, a mounting rod and a plurality of fixing rods arranged on the frame in a sliding manner; the plurality of second rubber rings are arranged on the mounting rod; a to-be-coated substrate is placed on the mounting rod of the substrate rack, resists against the second rubber rings, and is clamped among the plurality of fixing rods; the substrate rack is placed on the transmission shafts and resists against the first rubber rings; the substrate rack drives the to-be-coated substrate to horizontally run along with rotation of the transmission shafts. Coating is carried out by using the magnetron sputtering coating system, so that the yield is relatively high.

Description

technical field [0001] The invention relates to the technical field of magnetron sputtering, in particular to a magnetron sputtering coating system. Background technique [0002] Magnetron sputtering coating is a coating method commonly used at present. When the current magnetron sputtering coating system is used for coating, the substrate is generally run vertically or tilted at 45 degrees. In this way, the substrate must be fixed with a clamp, resulting in edge effects and low yield. Contents of the invention [0003] Based on this, it is necessary to provide a magnetron sputtering coating system capable of improving production yield. [0004] A magnetron sputtering coating system, including film feed chamber, film feed buffer chamber, film feed transition chamber, sputtering chamber, film discharge transition chamber, film discharge buffer chamber and film discharge chamber, also includes seven transmission devices and base racks, of which, [0005] The seven transmi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35C23C14/56
Inventor 张迅张伯伦李景艳易伟华
Owner WGTECH JIANGXI