Hold-down gear preventing lead frame from vibrating

Abstract

The invention discloses a hold-down gear preventing a lead frame from vibrating. The hold-down gear comprises an engine base, a connecting rod (1), a fixed rod (2), a driving shaft (3) and a clamping roller (4), wherein the long edge of an L plate (6) is vertical to a base-plate (5) and is arranged on the base-plate (5), and the short edge of the L plate (6) is provided with a bearing hole (7); one side of the connecting rod (1) is provided with a through hole I (8) and a through hole II (9), and a threaded hole I (10) and a threaded hole II (11) are arranged at the top of the connecting rod (1); the driving shaft (3) sequentially passes through the bearing hole (7) and the through hole I (8), the threaded hole I (10) is internally connected with a screw and the screw is pressed on the driving shaft (3), the driving rod (2) penetrates through the through hole II (9), and the threaded hole II (11) is internally connected with a screw and the screw is pressed on the fixed rod (2).

Description

technical field [0001] The invention relates to the technical field of lead frame processing used in the electronics industry, in particular to a pressing device for preventing vibration of the lead frame. Background technique [0002] At present, because the SOT-23 package lead frame is reel type, the material is soft and there are traction holes on it, in order to obtain the required electronic products, it is necessary to slice the lead frame and send it into the wire bonding machine for welding. [0003] At present, most domestic electronics companies install the slicing device on the left end of the wire bonding machine. After the slicing device slices the lead frame, it sinks into the index hole on the lead frame through the index pin traction mechanism, so that the traction frame is pulled by the traction mechanism. Pull it into the high-temperature welding area of ​​the wire bonding machine, and finally complete the wire bonding operation. However, the slicing devic...

AI Technical Summary

Problems solved by technology

However, the slicing device will generate a large mechanical vibration when cutting the lead frame. After the slicing device completes the cutting action, the lead frame will be displaced in the X direction during the mechanical vibration process, so that the subsequent index needle type The traction mechanism cannot align with the index hole on the lead frame during the sinking action, causing the soft lead frame to be squeezed and deformed, eventually causing the phenomenon of carding and scrapping the product, which will bring the following two negative effects: (1 ) leads to product scrap loss and increases costs; (2) card scrapping makes technicians have to spend time dealing with equipment failures and reduces worker productivity

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