A device and system for electroplating thin plates

A technology of electroplating plates and thin plates, applied in the direction of electrolysis process, electrolysis components, cells, etc., can solve the problems of low production efficiency, poor uniformity of coating thickness, high labor cost, etc., achieve high verticality, uniform coating thickness, and save labor costs Effect

Active Publication Date: 2017-03-01
KUNSHAN DONGWEI MACHINERY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the technical problem to be solved by the present invention is to overcome the disadvantages of the poor uniformity of the coating thickness of the electroplated plate processed by the existing electroplating thin plate device, low production efficiency, and high labor cost, and then provide an electroplating with high quality and high coating thickness. A device and system for electroplating thin plates with good uniformity, high production efficiency, and no need to consume a lot of labor costs

Method used

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  • A device and system for electroplating thin plates
  • A device and system for electroplating thin plates
  • A device and system for electroplating thin plates

Examples

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Effect test

Embodiment 1

[0044] see figure 1 , a device for electroplating thin plates, which includes an electroplating tank 5, a return channel 50 is provided in the electroplating tank 5, and an electroplating plate 6 is electroplated in the return channel 50; guides are provided on both sides of the electroplating plate 6 A flow device, the deflector is a deflector 14, the deflector 14 is located higher than the uppermost end of the electroplating plate 6, and symmetrically arranged on both sides of the electroplating plate 6, formed on the upper end of the electroplating plate 6 The diversion inlet 140 whose cross-sectional area gradually decreases from top to bottom, the electroplating metal solution from the anode device space 7 (the anode device space 7 is the position for placing the anode device of the electroplating tank 5) along the The surface of the deflector 14 flows from the flow guide inlet 140 to the return channel 50 of the electroplating tank 5 with a uniform thickness, and the fir...

Embodiment 2

[0048] see figure 1 , in this embodiment, in order to prevent the plating layer below the electroplating plate 6 from being too thick, the current limiting device is provided with a second device for guiding the direction of the electric force lines in the electroplating metal liquid flowing from the anode device space 7 to the electroplating plate 6. The flow guide device, the second flow guide device is made of insulating material, and the second flow guide device is arranged on the side of the filter screen 3 away from the electroplating plate 6 . The second deflector includes an upright support plate 1, and partitions 2 arranged at intervals along the height direction of the support plate 1, and the deflector 14 and the filter screen 3 are fixedly arranged on the The upper end of the support plate 1 and the two ends of the partition plate 2 are fixedly connected to the support plate 1 respectively, the partition plates 2 are arranged in several layers, and a gap is formed ...

Embodiment 3

[0053] see Figure 5 , On the basis of the above-mentioned embodiment one or two, the device for electroplating thin plates also includes a liquid storage tank 8 for storing the electroplating metal solution. The electroplating metal solution can be stored in the liquid storage tank 8 at first, and then injected into the liquid storage tank 8 when necessary. Electroplating is carried out in the electroplating tank 5. The liquid storage tank 8 is arranged below the electroplating tank 5 or other adjacent positions, and the liquid storage tank 8 and the electroplating tank 5 are connected through a second circulation pump 92 . An overflow port is provided on the side wall of the electroplating tank 5, the overflow port is higher than the uppermost end of the deflector, and the overflow port communicates with the liquid storage tank. When working, the second circulation pump 92 starts to inject the electroplating metal solution into the electroplating tank 5, and simultaneously ...

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PUM

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Abstract

The invention discloses a device and system for electroplating thin sheets. The device comprises an electroplating tank, flow-guiding devices and a first circulating device, wherein the electroplating tank is provided with a backflow channel, a conveying device for conveying electroplated thin sheets is arranged above the backflow channel; the flow-guiding devices are slantwise arranged at both sides of the electroplated thin sheets and located at the position higher than the uppermost ends of the electroplated thin sheets; electroplating metal liquid from an anode device space flows along the surface of the flow-guiding devices to the backflow channel in the electroplating tank at an uniform thickness from flow-guiding inlets; the liquid suction opening of the first circulating device is communicated with the backflow channel and the liquid discharging opening of the first circulating device is communicated with the anode device space. By virtue of the device for electroplating thin sheets disclosed by the invention, the uniform electroplating thickness of the electroplated thin sheets can be ensured, the quality of the electroplating is improved, the labor cost is saved and the production efficiency is improved.

Description

technical field [0001] The invention relates to a device and system for electroplating thin plates, belonging to the technical field of electroplating. Background technique [0002] When performing electroplating operations on thinner electroplated plates, since the substrate of such electroplated plates is soft, it is easy to deform, especially when the electroplated plate moves in the electroplating solution with the conveyor belt, the electroplating solution on both sides is sprayed to the On the board surface, a certain impact is formed on the electroplated board, which not only affects the quality of the electroplating, but also easily causes board jamming. [0003] In order to prevent the deformation of the thin-plate electroplated plate during processing, the traditional electroplating process adopts a method of adding a reinforced frame on the thin-plate electroplated plate to improve the anti-deformation performance of the plated plate. As Chinese patent document CN...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D7/00C25D17/00C25D21/10
Inventor 江泽军
Owner KUNSHAN DONGWEI MACHINERY CO LTD
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