Cap of photoresist bottle and photoresist bottle

Abstract

The invention provides a cap of a photoresist bottle and the photoresist bottle. The cap of the photoresist bottle comprises a bottle cap body, a cap core, a cover plate and a photoresist tube guide locking piece. The bottle cap body is connected with the opening of the photoresist bottle in a threaded mode through threads on the inner side of the lower portion of the bottle cap body. The cap core is located above the opening and on the inner side of the upper portion of the bottle cap body. The cover plate is located above the bottle cap body and the cap core and fixed to the cap core. An annular groove is formed between the cover plate and the cap core, the front end of the upper portion of the bottle cap body is embedded into the annular groove, and therefore the bottle cap body and the cover plate can neither be separated nor rotate independently, and the bottle cap body and the cap core can neither be separated nor rotate independently. Vertically-through holes are formed in the cap core and the cover plate, the photoresist tube guide locking piece penetrates through the holes and is fixed to the cap core and / or the cover plate in a threaded mode. The photoresist tube guide locking piece is hollow, and a photoresist tube guiding photoresist penetrates through the photoresist tube guide locking piece to be inserted into the photoresist bottle by a proper depth and is fixed to bottle cap body in a locking mode. According to the cap of the photoresist bottle and the photoresist bottle, the photoresist tube can be fixed to the cap of the photoresist bottle, evacuation caused when the photoresist tube can not be inserted to the bottom of the photoresist bottle is prevented, and therefore photoresist shortage of wafers is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing equipment, in particular, the invention relates to a photoresist plastic bottle cover and a plastic bottle. Background technique [0002] figure 1 It is a three-dimensional structure schematic diagram of a photoresist glue bottle cover used for supplying glue to glue application equipment in the prior art. Such as figure 1 As shown, the glue supply mode of the existing glue coating equipment (not shown) is to drill two holes on the glue bottle cover 101 of the photoresist glue bottle 100, so that the glue supply pipeline (outlet) 102 and the return pipeline ( Vent) 103 extend into the glue bottle 100 through the glue bottle cover 101 of the hole respectively, to realize the functions of glue supply and return flow. [0003] However, the existing glue supply method is limited by the structure of the glue bottle cover 101, so that the glue supply pipeline 102 and the return pi...

AI Technical Summary

Problems solved by technology

[0003] However, the existing glue supply method is limited by the structure of the glue bottle cover 101, so that the glue supply pipeline 102 and the return pipeline 103 cannot be fixed, and the glue supply pipeline 102 is often not inserted into the bottom of the glue bottle 100 (i.e. The glue pipeline 102 is often suspended), resulting in evacuation when supplying glue to the glue coating equipment, and the wafer (wafer) on the machine is short of glue

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