Resin composition for display substrates

A technology of resin composition and display, applied in the direction of instruments, coatings, optics, etc., can solve the problems of not having low linear expansion characteristics, expensive products, lack of versatility, etc.

Active Publication Date: 2014-09-24
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of most polyimide systems, the linear expansion coefficient of the film is in the range of 60 to 80 ppm / K, and does not have low linear expansion characteristics.
Among them, although a polyimide film with a low coefficient of linear expansion has been developed, the resulting product is expensive because an acid dianhydride, which is not versatile, is used as a raw material (Patent Document 3)

Method used

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  • Resin composition for display substrates
  • Resin composition for display substrates
  • Resin composition for display substrates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0214] Examples are given below to describe the present invention more specifically, but the present invention is not limited to the following examples.

[0215] [Abbreviated symbols used in Examples]

[0216] The meanings of the abbreviations used in the following examples are as follows.

[0217]

[0218] BP-TME: 4,4'-biphenyl bis(trimellitic acid monoester anhydride) (manufactured by Honshu Chemical Industry Co., Ltd.) (the following formula (12))

[0219] [chemical 19]

[0220]

[0221] TAHQ: p-phenylene bis(trimellitic acid monoester anhydride) (manufactured by Manac Co., Ltd.) (the following formula (13))

[0222] [chemical 20]

[0223]

[0224]

[0225] PDA: p-phenylenediamine (manufactured by Tokyo Chemical Industry Co., Ltd.)

[0226] HAB: 4,4'-diamino-3,3'-dihydroxybiphenyl (manufactured by Wakayama Seika Kogyo Co., Ltd.)

[0227] 4BP: 3,3'-diamino-4,4'-dihydroxybiphenyl (manufactured by Wakayama Seika Kogyo Co., Ltd.)

[0228]

[0229] V8000-C7: Na...

Synthetic example P1

[0234]

[0235] The PDA (0.154 mole) of 16.7g and the HAB (0.039 mole) of 8.34g are dissolved in the NMP of 700g, and the BP-TME (0.189 mole) of 101g is added, then the NMP of 74g is added again, under nitrogen atmosphere, make It was reacted at 23°C for 24 hours. The Mw of the obtained polymer was 129,000, and the molecular weight distribution was 2.5.

Synthetic example P2

[0236]

[0237] The PDA (0.156 mole) of 19.1g and the 4BP (0.039 mole) of 4.24g are dissolved in the NMP of 700g, and the BP-TME (0.192 mole) of 102g is added, then the NMP of 74g is added again, under nitrogen atmosphere, make It was reacted at 23°C for 24 hours. The Mw of the obtained polymer was 136300, and the molecular weight distribution was 2.4.

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Abstract

To provide a resin composition for display substrates which is capable of forming a useful polyimide film with an appropriate linear expansion coefficient and an appropriate flexibility. [Solution] This resin composition for display substrates contains a polyamic acid which includes a structural unit represented by formula (1) and a structural unit represented by formula (3), or a polyimide which includes a structural unit represented by formula (2) and a structural unit represented by formula (4). [In formulae 1 through 4, X1 represents a tetravalent organic group having an aromatic group and two or more carbonyl groups, Y1 represents a divalent organic group, Y2 represents a divalent organic group having an alkali-soluble group, and n and m represent natural numbers.]

Description

technical field [0001] The present invention relates to a resin composition for display substrates, specifically, a resin composition for display substrates capable of forming a useful polyimide film having a moderate linear expansion coefficient and moderate flexibility. Background technique [0002] Polyimide resins are widely used in the field of electrical and electronic materials because of their high heat resistance, flame retardancy, and excellent electrical insulation properties. Specifically, it is used as a film for base materials of flexible printed wiring boards and heat-resistant tapes, and as a resin varnish for insulating films and protective films of semiconductors. [0003] On the other hand, display devices such as organic EL (electroluminescence) displays and liquid crystal displays have been required only for high precision, but their applications are rapidly expanding to information equipment and the like. For example, flexible displays using plastic fi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08G59/40C08L79/08G02F1/1333G09F9/30
CPCC08G73/16C09D179/08C08L79/08C08G73/1042C08G73/14G09F9/30C08G73/1075C08G59/40G02F1/133305C08L63/00
Inventor 江原和也
Owner NISSAN CHEM IND LTD
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