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A resin film and composition technology, applied in the field of resin film forming compositions, can solve the problems of film strength and softness damage
Active Publication Date: 2019-09-03
NISSAN CHEM IND LTD
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[0006] As a polyimide exhibiting a low coefficient of linear expansion, a polyimide derived from tetracarboxylic dianhydride and a diamine having high rigidity has been proposed, but in the high-temperature region (300 to 300 ∼ 500°C) becomes a high linear expansion coefficient; when the rigidity of the polymer skeleton is too high, there are many problems such as damage to the strength and flexibility of the film (Patent Document 1, Non-Patent Document 1), which fully meet the high requirements polymer is still unknown
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[0119] Hereinafter, although an Example demonstrates this invention concretely, it is not limited to these Examples. In addition, the abbreviations of the compounds used are as follows.
[0120] [1] Abbreviations used in Examples
[0121] The abbreviations used in this example are as follows.
[0143] Dissolve 5.89 g (0.055 mol) of p-PDA and 3.55 g (0.014 mol) of TPDA in 160 g of NMP, add 14.6 g (0.067 mol) of PMDA at the same time, then add 16 g of NMP again, and make it React for 24 hours.
[0144] The Mw of the obtained polymer was 55,400, and the molecular weight distribution was 2.9.
Synthetic example P2
[0145]
[0146] PMDA / / p-PDA(80) / TPDA(19) / H-PAM(1)
[0147] Make p-PDA 1.474g (0.01363 mol), TPDA 0.843g (0.00324 mol) and H-PAM 0.042g (0.00017 mol) dissolved in NMP 34.00g, add PMDA 3.641g (0.01669 mol), then, under nitrogen atmosphere, It was allowed to react at 23°C for 24 hours.
[0148] The Mw of the obtained polymer was 45,100, and the molecular weight distribution was 2.5.
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Abstract
The present invention provides a resin film-forming composition characterized by containing the following components (A), (B) and (C). (A) component: the polyamic acid which contains the monomer unit represented by formula (1-1) and the monomer unit represented by formula (1-2), and has a weight average molecular weight of 5,000 or more. Formula (1‑1) (1‑2) (wherein, X 1 Represents benzene‑1,2,4,5‑tetrayl, Y 1 means p-phenylene, Y 2 Represents p-terphenyl-4,4"'-diyl.) (B) component: selected from monomer units comprising formula (1-1), monomer units shown in formula (1-2) and formula A polyamic acid having a monomer unit represented by (1-3) and having a weight average molecular weight of 5,000 or more, and a monomer unit represented by formula (1-1) and a monomer unit represented by formula (1-2) One of polyamic acids having a weight-average molecular weight of 5,000 or more with a monomer unit represented by formula (1-4). Formula (1-1)(1-2)(1-3)(1-4) [where, X 1 , Y 1 and Y 2 Indicates the same meaning as above, Y 3 A divalent group shown in formula (2), ‑R 1 ‑L‑R 2 ‑(2) (where L represents ‑O‑, ‑S‑, ‑CO‑ or ‑SO‑, R 1 and R 2 Each independently represents a divalent organic group. )X 2 Represents a tetravalent group containing an aromatic group having 6 to 25 carbon atoms selected from formula (3-1), formula (3-2), formula (3-3) and formula (3-4). Formula (3-1), (3-2), (3-3), (3-4) (in the formula, ○ represents a bond, and L represents the same meaning as above.)] (C) component: solvent.
Description
technical field [0001] The present invention relates to a composition for forming a resin film and a resin film. Background technique [0002] In recent years, in the fields of display devices such as organic electroluminescent displays and liquid crystal displays, there have been increasing demands for weight reduction, flexibility, and the like in addition to high definition. Under such circumstances, it is known that polyimide resin which is easy to manufacture and has high heat resistance is attracting attention as a display substrate material instead of glass. [0003] However, to use polyimide as a display substrate material, as described later, a value close to the linear expansion coefficient of glass (about 3 to 8 ppm / K) is required, but most polyimides have a value of 60 to 80 ppm / K. The coefficient of linear expansion is about 80ppm / K, so it is not suitable for display substrate materials. [0004] That is, a high-definition display uses an active matrix drive p...
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