Composition for forming thin resin film, and thin resin film

A resin film and composition technology, applied in the field of resin film forming compositions, can solve the problems of film strength and softness damage

Active Publication Date: 2017-08-29
NISSAN CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] As a polyimide exhibiting a low coefficient of linear expansion, a polyimide derived from tetracarboxylic dianhydride and a diamine having high rigidity has been proposed, but in the high-temperature region (300 to 300 ∼ 500°C) becomes a high linear expan

Method used

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  • Composition for forming thin resin film, and thin resin film
  • Composition for forming thin resin film, and thin resin film
  • Composition for forming thin resin film, and thin resin film

Examples

Experimental program
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Embodiment

[0119] Hereinafter, although an Example demonstrates this invention concretely, it is not limited to these Examples. In addition, the abbreviations of the compounds used are as follows.

[0120] [1] Abbreviations used in Examples

[0121] The abbreviations used in this example are as follows.

[0122]

[0123] PMDA: pyromellitic dianhydride

[0124] BPDA: 3,3-4,4-Biphenyltetracarboxylic dianhydride

[0125] α–BPDA: 2,3-3,4-Biphenyltetracarboxylic dianhydride

[0126] BPODA: 4,4'-(p-biphenyldioxy)bis(phthalic dianhydride)

[0127] ODPA: 4,4'-oxydiphthalic anhydride

[0128] HQDA: 4,4'-(p-phenylenedioxy)bis(phthalic dianhydride)

[0129] TAHQ: p-phenylene bis(trimellitic monoester anhydride)

[0130]

[0131] p-PDA: p-phenylenediamine

[0132] TPDA: 4,4”-diamino-p-terphenyl

[0133] H-PAM: 1,3-bis(3-aminopropyl)tetramethyldisiloxane

[0134] DDE: 4,4'-Diaminodiphenyl ether

[0135]

[0136] NMP: N-methyl-2-pyrrolidone

[0137]

[0138] The weight-average molecu...

Synthetic example P1

[0141]

[0142] PMDA / / p-PDA(80) / TPDA(20)

[0143] Dissolve 5.89 g (0.055 mol) of p-PDA and 3.55 g (0.014 mol) of TPDA in 160 g of NMP, add 14.6 g (0.067 mol) of PMDA at the same time, then add 16 g of NMP again, and make it React for 24 hours.

[0144] The Mw of the obtained polymer was 55,400, and the molecular weight distribution was 2.9.

Synthetic example P2

[0145]

[0146] PMDA / / p-PDA(80) / TPDA(19) / H-PAM(1)

[0147] Make p-PDA 1.474g (0.01363 mol), TPDA 0.843g (0.00324 mol) and H-PAM 0.042g (0.00017 mol) dissolved in NMP 34.00g, add PMDA 3.641g (0.01669 mol), then, under nitrogen atmosphere, It was allowed to react at 23°C for 24 hours.

[0148] The Mw of the obtained polymer was 45,100, and the molecular weight distribution was 2.5.

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Abstract

A composition for forming thin resin films, characterized by comprising the following ingredients (A), (B), and (C). Ingredient (A): a polyamic acid which has a weight-average molecular weight of 5,000 or higher and comprises a monomer unit represented by formula (1-1) and a monomer unit represented by formula (1-2) [Chemical formula 1] (in the formulae, X1 represents a benzene-1,2,4,5-tetrayl group, Y1 represents a p-phenylene group, and Y2 represents a p-terphenyl-4,4'''-diyl group). Ingredient (B): one polyamic acid selected from between a polyamic acid which has a weight-average molecular weight of 5,000 or higher and comprises a monomer unit represented by formula (1-1), a monomer unit represented by formula (1-2), and a monomer unit represented by formula (1-3) and a polyamic acid which has a weight-average molecular weight of 5,000 or higher and comprises a monomer unit represented by formula (1-1), a monomer unit represented by formula (1-2), and a monomer unit represented by formula (1-4) [Chemical formula 2] [in the formulae, X1, Y1, and Y2 have the same meanings as above, Y3 represents a divalent group represented by formula (2) [Chemical formula 3] -R1-L-R2- (2) (in formula (2), L represents -O-, -S-, -CO-, or -SO-, and R1 and R2 each independently represent a divalent organic group) and X2 represents a tetravalent group that includes a C6-25 aromatic group and is selected from among formulae (3-1), (3-2), (3-3), and (3-4) [Chemical formula 4] (in the formulae, O represents a linking bond and L has the same meaning as above)]. Ingredient (C): a solvent.

Description

technical field [0001] The present invention relates to a composition for forming a resin film and a resin film. Background technique [0002] In recent years, in the fields of display devices such as organic electroluminescent displays and liquid crystal displays, there have been increasing demands for weight reduction, flexibility, and the like in addition to high definition. Under such circumstances, it is known that polyimide resin which is easy to manufacture and has high heat resistance is attracting attention as a display substrate material instead of glass. [0003] However, to use polyimide as a display substrate material, as described later, a value close to the linear expansion coefficient of glass (about 3 to 8 ppm / K) is required, but most polyimides have a value of 60 to 80 ppm / K. The coefficient of linear expansion is about 80ppm / K, so it is not suitable for display substrate materials. [0004] That is, a high-definition display uses an active matrix drive p...

Claims

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Application Information

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IPC IPC(8): C08L79/08
CPCC08L79/08C08G73/10C08G73/1046C08G73/106C08G73/1064C08J5/18
Inventor 江原和也进藤和也小出泰之
Owner NISSAN CHEM IND LTD
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