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An impedance matching and signal shielding device for printed circuit board vias

A printed circuit board, impedance matching technology, applied in printed circuit components, magnetic field / electric field shielding, electrical connection printed components, etc., can solve the problems of unstable signal transmission, interference, etc., to enhance transmission quality, prevent signal interference, Enhance the cooling effect

Inactive Publication Date: 2017-01-11
XIHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For the three-layer circuit board, in order to prevent the signals of the signal layers between the circuit boards from easily interfering, the invention adopts the method of setting through holes and shielding parts, which can well solve the problem of unstable signal transmission. And the through hole also has good heat dissipation performance

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  • An impedance matching and signal shielding device for printed circuit board vias

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the drawings.

[0021] Such as figure 1 As shown, the present invention provides an impedance matching and signal shielding device for printed circuit board vias, which includes a first signal layer 1, a second signal layer 2, a third signal layer 3, a through hole 5 and a coaxial Cable via 4; wherein the first signal layer 1 is formed on one surface of a printed circuit board, the third signal layer 3 is formed on the other surface of the printed circuit board, and the second signal layer 2 is provided on the printed circuit board In the middle, a through hole 5 is respectively provided between the first signal layer 1, the second signal layer 2 and the third signal layer 3, and a shield 6 for shielding signals is provided in the through hole, and the shield 6 also has a supporting function; The coaxial cable-type via 4 is penetrated between the first signal layer 1, the second signal layer 2 and t...

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Abstract

The invention discloses an impedance matching and signal shielding device used for a printed circuit board via hole. Through holes are formed between a first signal layer, a second signal layer and a third signal layer respectively and provided with shielding pieces for shielding signals. The shielding pieces further have the supporting effect. The coaxial-cable type via hole is formed between the first signal layer, the second signal layer and the third signal layer in a penetrating mode and enables the first signal layer, the second signal layer and the third signal layer to be electrically connected. By means of the impedance matching and signal shielding device, the problem of mismatching of the impedance between the layers of a circuit board is well solved, different filling dielectrics can be selected, and therefore different impedances can be obtained; due to the fact that the through holes are formed between the signal layers, signal interference between the layers can be further prevented, radiating of the circuit board can be improved, and the shielding effect between the signal layers can be further achieved.

Description

Technical field [0001] The invention discloses an impedance matching and signal shielding device used for a printed circuit board via hole, and belongs to the technical field of printed circuit boards. Background technique [0002] At present, with the development of communication speed, signal integrity is essential to the smooth progress of signal transmission. Therefore, signal integrity has become one of the issues that must be paid attention to when designing printed circuit boards (PCBs). The parameters of the components and the printed circuit board and the layout of each component on the printed circuit board will affect the integrity of the signal, which will cause the system to work unstable or even not work at all. Therefore, how to use the printed circuit board The signal integrity factor is fully taken into account in the design process, and corresponding measures are taken, and it has become a hot topic in today's printed circuit board design. [0003] For printed c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/11H05K9/00
Inventor 王波
Owner XIHUA UNIV