An impedance matching and signal shielding device for printed circuit board vias
A printed circuit board, impedance matching technology, applied in printed circuit components, magnetic field / electric field shielding, electrical connection printed components, etc., can solve the problems of unstable signal transmission, interference, etc., to enhance transmission quality, prevent signal interference, Enhance the cooling effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0020] The present invention will be further described below in conjunction with the drawings.
[0021] Such as figure 1 As shown, the present invention provides an impedance matching and signal shielding device for printed circuit board vias, which includes a first signal layer 1, a second signal layer 2, a third signal layer 3, a through hole 5 and a coaxial Cable via 4; wherein the first signal layer 1 is formed on one surface of a printed circuit board, the third signal layer 3 is formed on the other surface of the printed circuit board, and the second signal layer 2 is provided on the printed circuit board In the middle, a through hole 5 is respectively provided between the first signal layer 1, the second signal layer 2 and the third signal layer 3, and a shield 6 for shielding signals is provided in the through hole, and the shield 6 also has a supporting function; The coaxial cable-type via 4 is penetrated between the first signal layer 1, the second signal layer 2 and t...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 
