Large-scale surface dual-layer oscillator array forming method

Abstract

The present invention provides a large-scale surface dual-layer oscillator array forming method. The method comprises the steps of: employing a planar copper-clad plate technology to manufacture a high-precision double-ring oscillator, forming an oscillator array carrier, determining an oscillator position and a distance parameter in the oscillator array according to electrical performance requirement of a dual-color subreflector and through analogue simulation, calculation backstepping and experiment test, processing a location hole on the oscillator array carrier through numerical control, employing step pins, and performing precious location of inner and outer layers of different parameter oscillators; and finally, gluing and fixing the oscillator unit on the carrier, and paving an oscillator unit protective layer so as to form a surface dual-layer oscillator array. The problem of forming of the large-scale surface dual-layer oscillator array is solved, the key technology of the dual-color sub-reflector forming is overcome, and the localization of the dual-color sub-reflector of the large-scale surface dual-layer oscillator array is achieved.

Description

technical field [0001] The invention relates to the technical field of antennas, in particular to a method for forming a large curved double-layer vibrator array. Background technique [0002] Dual-frequency or multi-frequency multiplexing is a new technology in modern radar antenna engineering, which can simplify design, simplify equipment and improve performance. Dual-frequency or multi-frequency multiplexing antennas have entered a mature application stage in western developed countries, and have been rapidly promoted and applied in the fields of resource satellites, communications, and military communications. However, foreign countries have imposed technological blockades on my country. The two-color sub-reflector (frequency selective surface FFS with frequency selectivity) is a key component in dual-frequency or multi-frequency multiplexing technology, which requires total reflection in some bands and full transmission in some bands. The forming technology of the curv...

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Problems solved by technology

The frequency selection of the single-layer oscillator array structure is difficult to meet the requirements of low insertion loss in both frequency bands, and the frequency band interval of the single-layer oscillator array is larger, and the reflection bandwidth is narrower.

[0005] The manufacturing process of the FSS sub-reflector itself is also very difficult. Foreign literature has claimed that the manufacturing process difficulty of the FSS sub-reflector itself is a kind of self-protection, and there is no need to apply for patent protection.

Usually, the vibrator array is first formed by electroplating on the carrier (the flat type can be coated with copper foil) and then formed by chemical etching or laser processing. For the FSS sub-reflector, the vibrator array is on the curved surface, so the copper foil cannot be used. , and the size of the sub-reflector is relatively large, and it is not suitable for electroplating. In addition, due to the large curvature of the sub-reflector, the current technology cannot perform curved surface exposure plate making

Therefore, there is no effective and practical method for forming the double-layer oscillator array in the FSS sub-reflector in China at present.

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