This invention discloses a
simulation method, apparatus, medium, and device for
flip chip underfill, relating to the field of
flip chip underfill
simulation technology. The invention simulates the
flip chip underfill process within a computational domain divided into two meshes in a flow plane perpendicular to the
depth direction using a
color gradient lattice Boltzmann model. A
color function clearly distinguishes between the
wetting phase (filler
adhesive) and the non-
wetting phase (air) to dynamically track the two-phase interface. When simulating the flow field changes during the self-absorption process of flip
chip underfill, the average curvature of the interface in the
depth direction and the average frictional force of the upper and lower
solid walls of the flip
chip are introduced to determine the force applied at the two-phase
fluid interface, thus reflecting three-dimensional physical effects. While maintaining near-two-dimensional computational costs, this invention significantly improves the accuracy of flip
chip underfill
simulation and can quickly predict the entire flip chip underfill process at a lower cost.