Liquid cooling rack of miniature array device

Abstract

The invention provides a liquid cooling rack of a miniature array device. Flow dividers are connected with an external cooling liquid source through self-sealing bayonet liquid connectors. Main flow channels of the flow dividers are provided with branch flow channels for dividing cooling liquid to module cold plates and power cold plates. The module cold plates are communicated with the flow dividers through blind insertion liquid connectors. A mounting space for a receiving and dispatching module is formed between the adjacent module cold plates. The two power cold plates are fixedly arranged above and below the integration of the module cold plates respectively. The power cold plates are connected with a digital processing module integrated liquid cooling structure through self-sealing blind insertion liquid connectors. The liquid cooling rack has the functions of complex flow channel organization, heat dissipation and force bearing; through a compact and ingenious structural layout and flow channel design, heat dissipation of the receiving and dispatching module with high heating flux density is achieved through limited liquid cooling resources; meanwhile, effective heat management of multiple functional modules with differentiated heat dissipation requirements is achieved, and the miniaturization requirement for platform loading is met.

Description

technical field [0001] The invention relates to the technical field of thermal management and structural design of avionics equipment, and specifically relates to a liquid-cooled rack for miniaturized array equipment. Background technique [0002] The RF front-end equipment of an active phased array system (hereinafter referred to as equipment) usually consists of a transceiver module, a digital processing module, a power supply module, other functional modules and a liquid-cooled rack. The continuous improvement of equipment performance has led to the continuous increase of device heat flux density and total heat dissipation power of equipment, thus putting forward higher requirements for heat dissipation capability, and the miniaturization requirements of military aviation platforms for equipment have exacerbated the difficulty of heat dissipation for equipment. [0003] There are two solutions based on current structural technology. First, the customized drawer-type liqu...

AI Technical Summary

Problems solved by technology

However, only the transceiver module can effectively dissipate heat, while the power module and digital processing module often have poor heat dissipation and performance degradation or shutdown; when replacing the transceiver module, the device needs to be completely disassembled, and there is a thermal adjustment after the liquid cooling rack is disassembled. link, resulting in poor maintainability

[0004] Neither of these two solutions can simultaneously solve the problems of high heat flux dissipation, effective thermal management of equipment, and maintainability under the constraints of limited liquid cooling resources and miniaturization

Images