LED (light emitting diode) packaging method
A technology of LED encapsulation and encapsulation method, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve problems such as difficult adjustment of chip mounting and wire bonding process, low lead frame etching precision, and poor product consistency, etc., to achieve Effects of Overcoming Warpage Defects, Improving Yield and Consistency, and Solving Coordination Issues
Active Publication Date: 2014-10-22
JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD
View PDF4 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
In the EMC packaging method, the lead frame is formed by a wet etching process, that is, the so-called half-etching process. The warpage of the lead frame itself formed by this process is relatively large, which makes it difficult to adjust the chip mounting and wiring process. , the loss of yield is large; at the same time, the etching precision of the lead frame formed by this process is low, and the consistency of the product is not good
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0068] Examples, see figure 2 and image 3
[0069] An LED packaging structure, which includes a metal lead frame body 1 and an LED chip 2 , the LED chip 2 is mounted on the metal lead frame body 1 . The metal lead frame body 1 is composed of a metal block I11, a metal block II12, a metal block III13 and an encapsulation layer 10 encapsulating the metal block I11, the metal block II12, and the metal block III13. The metal block III13 is located in the center of the metal lead frame body 1 and occupies the largest area. The metal block I11 is set on the left side of the metal block III13, the metal block II12 is set on the right side of the metal block III13, and the metal block I11 , metal block II12, and metal block III13 are equal in height.
[0070] The upper parts of metal block I11, metal block II12, and metal block III13 are rewiring metal layers 111, 112, 113 respectively, and the lower parts are metal blocks 121, 122, 123 respectively, and the metal rewiring layer ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| Height | aaaaa | aaaaa |
Login to View More
Abstract
The invention discloses an LED packaging method and belongs to the technical field of semiconductor package. The method comprises, firstly, repeatedly performing high-precision electroplating processes by taking iron foils (8) as conducting layers, and forming re-wiring metal layers and metal blocks by combining a photoetching technique; secondly, encapsulating the re-wiring metal layers and the metal blocks through encapsulating resin to form a metal lead frame body (1); thirdly, fixedly mounting LED chips (2) right onto the metal lead frame body (1); lastly, completing the whole packaging structure. According to the LED packaging method, the metal lead frame body is obtained through the high-precision electroplating processes, so that the deficiency of warping of frames in wet etching processes can be overcome, the problem of coordination of chip placement and routing processes can be effectively solved, and the yield rate and the homogeneity of products can be improved.
Description
technical field [0001] The invention relates to an LED packaging method, which belongs to the technical field of semiconductor packaging. Background technique [0002] Under the background of energy saving and environmental protection, my country's LED industry is developing rapidly, and the development prospects of the LED industry are very promising. EMC (epoxy encapsulation material) packaging is one of the current high-end development directions of the LED industry. In the EMC packaging method, the lead frame is formed by a wet etching process, that is, the so-called half-etching process. The warpage of the lead frame itself formed by this process is relatively large, which makes it difficult to adjust the chip mounting and wiring process. , the loss of yield is large; at the same time, the etching precision of the lead frame formed by this process is low, and the consistency of the product is not good. Contents of the invention [0003] The purpose of the present inv...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/62H01L2933/0066H01L2224/8592H01L2224/48091H01L2924/00014
Inventor 张黎赖志明陈栋陈锦辉
Owner JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD