A kind of LED encapsulation method
A technology of LED packaging and packaging method, applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of difficult adjustment of chip mounting and wire bonding processes, low lead frame etching accuracy, and poor product consistency. Overcome warpage defects, improve yield and consistency, solve coordination problems
Active Publication Date: 2016-08-17
JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD
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Problems solved by technology
In the EMC packaging method, the lead frame is formed by a wet etching process, that is, the so-called half-etching process. The warpage of the lead frame itself formed by this process is relatively large, which makes it difficult to adjust the chip mounting and wiring process. , the loss of yield is large; at the same time, the etching precision of the lead frame formed by this process is low, and the consistency of the product is not good
Method used
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Embodiment
[0067] Examples, see figure 2 and image 3
[0068] An LED packaging structure, which includes a metal lead frame body 1 and an LED chip 2 , the LED chip 2 is mounted on the metal lead frame body 1 . The metal lead frame body 1 is composed of a metal block I11, a metal block II12, a metal block III13 and an encapsulation layer 10 encapsulating the metal block I11, the metal block II12, and the metal block III13. The metal block III13 is located in the center of the metal lead frame body 1 and occupies the largest area. The metal block I11 is set on the left side of the metal block III13, the metal block II12 is set on the right side of the metal block III13, and the metal block I11 , metal block II12, and metal block III13 are equal in height.
[0069] The upper parts of metal block I11, metal block II12, and metal block III13 are rewiring metal layers 111, 112, 113 respectively, and the lower parts are metal blocks 121, 122, 123 respectively, and the metal rewiring layer ...
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Abstract
The invention discloses an LED packaging method, which belongs to the technical field of semiconductor packaging. In the present invention, the iron foil (8) is used as the conductive layer to carry out high-precision electroplating process many times, combined with the photolithography process to realize the rewiring metal layer and metal block, and then encapsulating the rewiring metal layer and metal block with encapsulating resin to form a metal The lead frame body (1), and then the LED chip (2) is mounted and fixed on the metal lead frame body (1), and then the entire packaging structure is completed. The invention adopts a high-precision electroplating process to realize the metal lead frame body, overcomes the warping defect of the frame existing in the wet corrosion process, effectively solves the coordination problem of the chip mounting and wire bonding process, and improves the yield rate and consistency.
Description
technical field [0001] The invention relates to an LED packaging method, which belongs to the technical field of semiconductor packaging. Background technique [0002] Under the background of energy saving and environmental protection, my country's LED industry is developing rapidly, and the development prospects of the LED industry are very promising. EMC (epoxy encapsulation material) packaging is one of the current high-end development directions of the LED industry. In the EMC packaging method, the lead frame is formed by a wet etching process, that is, the so-called half-etching process. The warpage of the lead frame itself formed by this process is relatively large, which makes it difficult to adjust the chip mounting and wiring process. , the loss of yield is large; at the same time, the etching precision of the lead frame formed by this process is low, and the consistency of the product is not good. Contents of the invention [0003] The purpose of the present inv...
Claims
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IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/62H01L2933/0066H01L2224/8592H01L2224/48091H01L2924/00014
Inventor 张黎赖志明陈栋陈锦辉
Owner JIANGYIN CHANGDIAN ADVANCED PACKAGING CO LTD