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Combined type measurement and three-dimensional reconstruction method combing Kinect and articulated arm

A technology of 3D reconstruction and articulated arm, which is applied in the field of compound measurement and 3D reconstruction, and can solve problems such as difficult to meet measurement requirements

Inactive Publication Date: 2014-10-29
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Due to the specificity and complexity of physical sample parts, it is often difficult to meet the actual engineering measurement requirements by using a single measurement method alone.

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  • Combined type measurement and three-dimensional reconstruction method combing Kinect and articulated arm
  • Combined type measurement and three-dimensional reconstruction method combing Kinect and articulated arm
  • Combined type measurement and three-dimensional reconstruction method combing Kinect and articulated arm

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Embodiment Construction

[0057] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0058] In the following description, specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways than those described here, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Accordingly, the present invention is not limited to the specific embodiments disclosed below.

[0059] The equipment used in this application includes: a Microsoft Kinect device, an articulated arm measuring instrument, a plurality of calibration spheres (fixedly placed around the object to be measured during measurement) and a computer equipped with a GPU (Kinect, articulated arm mea...

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Abstract

The invention provides a combined type measurement and three-dimensional reconstruction method combing a Kinect device and an articulated arm measuring instrument. Firstly, quickly obtaining point cloud data of an object through the Kinect, performing secondary measuring on feature information which cannot be obtained by the Kinect and on features with high accuracy requirements through the articulated arm, completing fusion of different data source information by means of point cloud registration technology, and reconstructing a three-dimensional model of the object. According to the combined type measurement and three-dimensional reconstruction method combing the Kinect device and the articulated arm measuring instrument, non-contact measurement and contact type measurement are combined together, not only the problem of low accuracy of the non-contact measurement can be solved, but also point cloud data with lost boundaries and concave holes and the like can be effectively repaired, meanwhile, measuring efficiency can be improved, and novel technology and means are provided for data acquisition.

Description

technical field [0001] The invention relates to a compound measurement and three-dimensional reconstruction method combining Kinect and an articulated arm. Background technique [0002] As an important branch of computer vision technology, 3D reconstruction technology has always been one of the hottest research directions in the field of computer vision. It belongs to a multidisciplinary research field and is an important application of computer graphics and image processing in engineering. [0003] The measuring equipment converts the surface shape of the object into coordinate points in geometric space through a specific method, so as to obtain the data required for reverse modeling. The data acquisition method based on contact measurement has high accuracy and reliability, and can accurately measure the basic geometric shapes of objects, such as surfaces, circles, cylinders, cones, spheres, etc., but the data acquisition efficiency is low. The data acquisition method b...

Claims

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Application Information

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IPC IPC(8): G06T17/00G01B11/24
Inventor 何炳蔚林建楠李海榕董升升
Owner FUZHOU UNIV
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