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A substrate-integrated waveguide broadband bandpass filter loaded with i-shaped defect ground structure

A substrate-integrated waveguide and defective ground structure technology, which is applied to waveguide devices, electrical components, circuits, etc., can solve the problems of high operating frequency of SIW filters and unsuitable mobile communication systems in the working frequency band, and achieve light weight and easy Integrated, low profile effect

Active Publication Date: 2017-01-18
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem that the existing SIW filter has generally high operating frequency and is not suitable for mobile communication systems with low operating frequency bands, the present invention further proposes a substrate-integrated waveguide broadband band-pass filter with a structure loaded with I-shaped defects device

Method used

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  • A substrate-integrated waveguide broadband bandpass filter loaded with i-shaped defect ground structure
  • A substrate-integrated waveguide broadband bandpass filter loaded with i-shaped defect ground structure
  • A substrate-integrated waveguide broadband bandpass filter loaded with i-shaped defect ground structure

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specific Embodiment approach 1

[0007] Embodiment 1: Combining Figure 1 to Figure 5 Illustrating this embodiment, a substrate-integrated waveguide broadband bandpass filter with a structure loaded with I-shaped defects described in this embodiment includes a first metal printing layer 1 , a dielectric substrate 2 , a second metal printing layer 3 and two balanced The microstrip line 4, the first metal printing layer 1, the dielectric substrate 2, and the second metal printing layer 3 are all rectangular thin plates, and the first metal printing layer 1, the dielectric substrate 2, and the second metal printing layer 3 are arranged in order from top to bottom , the first metal printing layer 1 is printed on the upper surface of the dielectric substrate 2, the second metal printing layer 3 is printed on the middle of the lower surface of the dielectric substrate 2, and the two balanced microstrip lines 4 are printed on the lower surface of the dielectric substrate 2, And two balanced microstrip lines 4 are lo...

specific Embodiment approach 2

[0009] Specific implementation mode 2: Combining Figure 1 to Figure 3 This embodiment is described. Each balanced microstrip line 4 of the substrate-integrated waveguide broadband bandpass filter with I-shaped defect-loaded structure described in this embodiment is composed of a first rectangular section 4-1, an isosceles trapezoidal section 4 -2 is composed of a second rectangular segment 4-3, one end of the first rectangular segment 4-1 is connected to the middle of one end corresponding to the second metal printing layer 3, and the other end of the first rectangular segment 4-1 is connected to the isosceles trapezoid segment The bottom edge of 4-2 is connected, the top edge of the isosceles trapezoid segment 4-2 is connected with one end of the second rectangular segment 4-3, and the other end of the second rectangular segment 4-3 is connected to the end corresponding to the lower surface of the dielectric substrate 2 Central connection.

[0010] The technical effect of t...

specific Embodiment approach 3

[0011] Specific implementation three: combination Figure 1 to Figure 3 Illustrating this embodiment, each first I-shaped defect structure group of the substrate-integrated waveguide broadband bandpass filter loaded with an I-shaped defect structure described in this embodiment includes three first I-shaped defect structures 6 , each first I-shaped defect ground structure 6 is composed of a first vertical groove 6-1 and two second horizontal grooves 6-2, and each second I-shaped defect ground structure group includes two second I-shaped defect ground Structure 7, each second I-shaped defect structure 7 includes a second vertical groove 7-1 and two second transverse grooves 7-2.

[0012] The technical effect of this embodiment is that the configuration ensures that the grooves of the loaded I-shaped defect structure can be equivalent to parallel or series inductance elements in the passband, and together with other parameters, form a bandpass filter network. Other components a...

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Abstract

The invention relates to an SIW broadband band-pass filter, in particular to an SIW broadband band-pass filter loaded with an I-shaped defected ground structure. The SIW broadband band-pass filter aims at solving the problems that an existing SIW filter is high in working frequency generally and is not applicable to a mobile communication system low in working frequency band. The SIW broadband band-pass filter comprises a first metal printing layer, a dielectric substrate, a second metal printing layer and two balance microstrip lines, wherein the first metal printing layer, the dielectric substrate and the second metal printing layer are respectively a rectangular sheet and are arranged sequentially from top to bottom, the first metal printing layer is printed on the upper surface of the dielectric substrate, and the second metal printing layer is printed to the middle of the lower surface of the dielectric substrate. The SIW broadband band-pass filter loaded with the I-shaped defected ground structure is applied to the field of wireless communications.

Description

technical field [0001] The invention relates to a substrate-integrated waveguide broadband band-pass filter, in particular to a substrate-integrated waveguide broadband band-pass filter with an I-shaped defect-loaded structure, belonging to the field of wireless communication. Background technique [0002] Substrate Integrated Waveguide, also known as Substrate Integrated Waveguide (SIW), is a new type of waveguide structure proposed in recent years. Due to the advantages of low radiation, low insertion loss, miniaturization, and easy integration, the structure has become a research hotspot and is also widely used in filter design. With the aid of printed circuit technology, low-cost mass production of dielectric integrated waveguide based filters is possible. However, the bandwidth of the common substrate-integrated waveguide bandpass filter is generally narrow, generally less than 10%, which cannot meet the higher requirements of the mobile communication system. Moreover...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01P1/203
Inventor 林澍罗晓赵志华刘冠君王立娜耿姝
Owner HARBIN INST OF TECH