Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- RIIDO
- Publication Date
- 2014-11-05
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The present invention relates to a fixed abrasive wire saw suitable for cutting and processing workpieces made of hard and brittle materials such as silicon, sapphire, silicon carbide, ceramic materials, magnetic materials, etc. The cutting method of the above-mentioned workpiece. Background technique
[0002] As a kind of wire saw used for cutting and processing hard and brittle materials such as silicon, sapphire, and magnetic materials, in the past, abrasive grains composed of diamond etc. Fixed-grain wire saws in which deposited metal plating is fixed are known. And, as a representative manufacturing method thereof, Patent Document 1 discloses a method of passing electricity through a metallic steel wire that has settled in an abrasive grain layer in a plating bath.
[0003] The fixed abrasive wire saw formed by such electrodeposition has the advantages of high retention force of abrasive grains and difficulty in threshing, but because the abrasi...