Fixed-abrasive-grain wire-saw, method for manufacturing same, and method for cutting workpiece using same

A technology for fixing abrasive grains and wire saws, applied in the direction of manufacturing tools, metal sawing equipment, knives of sawing machine devices, etc., can solve problems such as worrying about not being eliminated, and achieve the effect of high-precision cutting
CN104136169AInactive Publication Date: 2014-11-05RIIDO

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
RIIDO
Publication Date
2014-11-05
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

[Problem] To provide a fixed-abrasive-grain wire-saw that enables improved workpiece cutting plane accuracy and grinding efficiency and further allows for a longer product service life, a method for manufacturing the fixed-abrasive-grain wire-saw, and a method for cutting a work piece using the fixed-abrasive-grain wire-saw. [Solution] When abrasive grains (2) are to be affixed to the external peripheral surface of a metallic core wire (1), a plurality of transfer rollers (18) provided with a plurality of very small holes (18a) filled with an adhesive (3a) are used to transfer the adhesive (3a) onto the external peripheral surface of the metallic core wire, whereby a plurality of lines (li) of a punctate adhesive layer (3) axially arranged in straight lines at a regular pitch are formed on the metallic core wire; and, after being provisionally bonded to the adhesive layer, the abrasive grains are permanently bonded by electrodeposition on a metallic plating layer (4).
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a fixed abrasive wire saw suitable for cutting and processing workpieces made of hard and brittle materials such as silicon, sapphire, silicon carbide, ceramic materials, magnetic materials, etc. The cutting method of the above-mentioned workpiece. Background technique

[0002] As a kind of wire saw used for cutting and processing hard and brittle materials such as silicon, sapphire, and magnetic materials, in the past, abrasive grains composed of diamond etc. Fixed-grain wire saws in which deposited metal plating is fixed are known. And, as a representative manufacturing method thereof, Patent Document 1 discloses a method of passing electricity through a metallic steel wire that has settled in an abrasive grain layer in a plating bath.

[0003] The fixed abrasive wire saw formed by such electrodeposition has the advantages of high retention force of abrasive grains and difficulty in threshing, but because the abrasi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More