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Parallel seam welding packaging device

A parallel seam welding and packaging device technology, which is applied in the direction of auxiliary devices, straight seam welding, welding equipment, etc., can solve the problems of low production efficiency, high material cost, and different dimensions, so as to save costs and improve The effect of production efficiency

Inactive Publication Date: 2014-11-19
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the dimensions of the dual-in-line metal casings are different, and the number of pins and the distance between the pins are also different. Therefore, the packaging device must be designed separately for various types of metal casings, which cannot be reused, and the material cost is high. When welding different types of metal shells in parallel, the corresponding packaging device needs to be replaced, and the production efficiency is low

Method used

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Embodiment Construction

[0016] Such as figure 1 As shown, the present invention provides a parallel seam welding packaging device, including a base 4 arranged on a parallel seam welding receiving platform 6, a positioning hole 11 is provided on the base 4, and the base is realized through the cooperation of the positioning hole 11 and the positioning pin 5 4 and the positioning of the chip holder 6; the top surface of the base 4 is provided with a square groove 7, and the depth of the square groove 7 is less than the height of the dual in-line metal shell 3 to be clamped; combined figure 2 and image 3 As shown, the square groove 7 is vertically provided with rectangular columns 9 evenly distributed in an array, the number of rectangular columns 9 is an odd number in the horizontal direction, and an even number in the vertical direction, and grooves with the same width are formed between adjacent rectangular columns. 10. The groove 10 is matched with the pin 8 of the metal shell, and the rectangula...

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Abstract

The invention discloses a parallel seam welding packaging device. The device comprises a base (4) which is arranged on a parallel seam welding piece bearing table, and a square groove (7) is formed in the top surface of the base (4). The depth of the square groove is smaller than the height of a dual-in-line outer metal shell (3) needing clamping, and rectangular pillars (9) are evenly distributed vertically in the square groove (7) in an arrayed mode. The number of the rectangular pillars (9) is an odd number in the transverse direction and an even number in the longitudinal direction. Grooves (10) are formed between the adjacent rectangular pillars and are uniform in width. The grooves (10) are in clearance fit with pins (8) of the outer metal shell (3) to form pair insertion. Because the distance of the pins of the dual-in-line outer metal shell is integer multiples of 2.54 mm, various types of dual-in-line outer metal shells can be accurately clamped and positioned, cost is reduced, frequent device replacing is not needed, and production efficiency is improved.

Description

technical field [0001] The invention relates to the field of electronic manufacturing, in particular to a parallel seam welding packaging device. Background technique [0002] As known, parallel seam welding is single-sided double-electrode contact resistance welding, which is a kind of seam welding. It is a new welding technology for microelectronic devices developed to adapt to the capping of ceramic dual-in-line integrated circuits. However, the dimensions of the dual-in-line metal casings are different, and the number of pins and the distance between the pins are also different. Therefore, the packaging device must be designed separately for various types of metal casings, which cannot be reused, and the material cost is high. When welding different types of metal shells in parallel, the corresponding packaging devices need to be replaced, and the production efficiency is low. Contents of the invention [0003] The purpose of the present invention is to provide a para...

Claims

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Application Information

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IPC IPC(8): B23K11/36B23K11/08
CPCB23K11/36B23K11/061B23K37/0426
Inventor 李寿胜侯育增夏俊生李波张静
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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