Circuit board assembly method

An assembly method and circuit board technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as manual labor, design that cannot meet the wave peak, and direct wave soldering, etc., so as to improve the efficiency of soldering and increase the market Application value, effect of saving assembly manpower

Inactive Publication Date: 2014-11-19
SHENZHEN JIUBABA ELECTRONICS
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  • Abstract
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Problems solved by technology

[0005] 2) Design products that cannot meet the wave peak, and then print solder paste on the PCB → SMT surface mount → over-reflow soldering → SMT appearance inspection → manual soldering of DIP components
[0006] In this way, due to PCB design, many boards must design SMD devices (SMT devices) and through-hole plug-in devices (DIP through-hole devices) on the same plane according to the specific characteristics of the product, and because of the high density of compone

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  • Circuit board assembly method
  • Circuit board assembly method

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[0028] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below with reference to the drawings and specific embodiments. The preferred embodiments of the present invention are given in this specification and its drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when a component is fixed to another component, it includes directly fixing the component to the other component, or fixing the component to the other component through at least one other central component . When a component is connected to another component, it includes directly connecting the component to the other component, or connecting the component...

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Abstract

The invention provides a circuit board assembly method which comprises the following steps: conducting a surface mount process, namely setting a program for a SMT (Surface Mount Technology) machine according to an XY coordinate file of a PCB (Printed Circuit Board), printing tin paste on the PCB by a SMT tin paste template (namely a steel mesh), putting SMT components onto the machine, and performing the surface mount process on the SMT components to obtain a surface mount plate; inserting, namely inserting DIP (Double In-line Package) components into a jig, and inserting the surface mount plate into the jig and the DIP components of the jig to obtain a circuit board to be soldered; soldering, namely performing reflow soldering on the jig and the circuit board to be welded. Due to the adoption of the scheme, an existing wave soldering process of the through-hole DIP components is changed to a reflow soldering process, so that the assembly manpower is saved, the SMT and DIP component soldering efficiency is improved, and the product reject ratio in an automated production process is reduced; the circuit board assembly method has very high market application values.

Description

technical field [0001] The invention relates to a circuit board assembly process, in particular to a circuit board assembly method. Background technique [0002] Circuit board surface mount technology and through-hole component plug-in technology are collectively referred to as printed circuit board assembly (PCB assembly); among them, surface mount is called SMT, and plug-in is called DIP. [0003] Existing circuit board assembly technology usually uses wave soldering, for example, the prior art circuit board assembly production process is: [0004] 1) Design a product that can meet the wave peak, and then print solder paste on the PCB → SMT surface mount → over-reflow soldering → SMT appearance inspection → DIP plug-in → over-wave soldering → appearance inspection; [0005] 2) Design products that cannot meet the wave peak, and then print solder paste on the PCB → SMT surface mount → over-reflow soldering → SMT appearance inspection → manual soldering of DIP components. ...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 王小明
Owner SHENZHEN JIUBABA ELECTRONICS
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