Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit board assembly method

An assembly method and circuit board technology, which is applied in the direction of assembling printed circuits with electrical components, can solve problems such as manual labor, design that cannot meet the wave peak, and direct wave soldering, etc., so as to improve the efficiency of soldering and increase the market Application value, effect of saving assembly manpower

Inactive Publication Date: 2014-11-19
SHENZHEN JIUBABA ELECTRONICS
View PDF6 Cites 22 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 2) Design products that cannot meet the wave peak, and then print solder paste on the PCB → SMT surface mount → over-reflow soldering → SMT appearance inspection → manual soldering of DIP components
[0006] In this way, due to PCB design, many boards must design SMD devices (SMT devices) and through-hole plug-in devices (DIP through-hole devices) on the same plane according to the specific characteristics of the product, and because of the high density of components Makes it impossible to meet the requirements of wave soldering in the manufacturing process
[0007] Moreover, the existing wave soldering technology is aimed at the high density of components, and when designing the PCB with patch components (SMT components) and plug-in components (DIP components) on the same side, direct wave soldering is usually not possible. ; After the SMT patch is done, after inserting the through-hole device, it can only be soldered manually

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board assembly method
  • Circuit board assembly method
  • Circuit board assembly method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. Preferred embodiments of the present invention are given in the description and drawings, but the present invention can be implemented in many different forms and is not limited to the embodiments described in the description. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when a certain component is fixed to another component, it includes directly fixing the component to the other component, or fixing the component to the other component through at least one other component in the middle . When a component is connected to another component, it includes directly connecting the component to the other component, or connecting the component t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a circuit board assembly method which comprises the following steps: conducting a surface mount process, namely setting a program for a SMT (Surface Mount Technology) machine according to an XY coordinate file of a PCB (Printed Circuit Board), printing tin paste on the PCB by a SMT tin paste template (namely a steel mesh), putting SMT components onto the machine, and performing the surface mount process on the SMT components to obtain a surface mount plate; inserting, namely inserting DIP (Double In-line Package) components into a jig, and inserting the surface mount plate into the jig and the DIP components of the jig to obtain a circuit board to be soldered; soldering, namely performing reflow soldering on the jig and the circuit board to be welded. Due to the adoption of the scheme, an existing wave soldering process of the through-hole DIP components is changed to a reflow soldering process, so that the assembly manpower is saved, the SMT and DIP component soldering efficiency is improved, and the product reject ratio in an automated production process is reduced; the circuit board assembly method has very high market application values.

Description

technical field [0001] The invention relates to a circuit board assembly process, in particular to a circuit board assembly method. Background technique [0002] Circuit board surface mount technology and through-hole component plug-in technology are collectively referred to as printed circuit board assembly (PCB assembly); among them, surface mount is called SMT, and plug-in is called DIP. [0003] Existing circuit board assembly technology usually uses wave soldering, for example, the prior art circuit board assembly production process is: [0004] 1) Design a product that can meet the wave peak, and then print solder paste on the PCB → SMT surface mount → over-reflow soldering → SMT appearance inspection → DIP plug-in → over-wave soldering → appearance inspection; [0005] 2) Design products that cannot meet the wave peak, and then print solder paste on the PCB → SMT surface mount → over-reflow soldering → SMT appearance inspection → manual soldering of DIP components. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/34
Inventor 王小明
Owner SHENZHEN JIUBABA ELECTRONICS
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com