Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Double-interface metal intelligent chip card and manufacture method

A dual-interface, chip card technology, applied to record carriers, instruments, computer parts, etc. used in machines, can solve the problem of reduced sensing distance of contactless cards, inability to realize dual-interface transaction function, and difficulty in batch processing of metal cards and other problems, to achieve perfect visual effect, improve anti-electromagnetic interference characteristics, wear-resistant, stain-resistant and scratch-resistant effects

Active Publication Date: 2014-11-26
GOLDPAC GRP LTD
View PDF7 Cites 21 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, batch processing of this kind of metal card is difficult and costly, and the most important thing is that the dual-interface transaction function cannot be realized
[0006] The above two cards are made of metal on one side, the edge of the body or the body itself. The IC card is made of metal film or metal sheet, which further improves the overall appearance of the card, making it more high-end and atmospheric, providing More card styles improve the durability and tactile experience of the card, but because the card has a metal layer, the metal layer has a shielding effect on the electromagnetic wave signal sent and received by the antenna, so the card can only be a single contact Cards, the sensing distance of non-contact cards is reduced by the shielding effect of the metal layer, which cannot meet the needs of users

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Double-interface metal intelligent chip card and manufacture method
  • Double-interface metal intelligent chip card and manufacture method
  • Double-interface metal intelligent chip card and manufacture method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] The present invention will be described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present invention in detail, for the convenience of explanation, the accompanying drawings showing the structure of the device will not be partially enlarged according to the general scale, and the schematic diagram is only an example, and it should not be limited here. The protection scope of the present invention. It should be noted that the drawings are in simplified form and use inaccurate scales, which are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0033] The dual-interface smart chip card of the present invention refers to a chip card that can support both contact and non-contact communication methods. Reading and writing of information. Since ordinary metal materials can shield electromagnetic waves, the sensing distance of IC cards containing metal ma...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a double-interface metal intelligent chip card and a manufacture method. The double-interface metal intelligent chip card comprises a metal card body. The metal card body is provided with an interlayer, a printing sheet layer and a transparent protection layer which are positioned on the metal card body. The metal card body, the interlayer, the printing sheet layer and the transparent protective layer constitute a card base for the intelligent chip card. The base card is provided with a concave cavity for containing an IC module; the metal card body is a wave-absorption material metal card body; the interlayer is provided with an induction antenna; the IC module comprises a chip and a coupling micro antenna which is electrically connected to the chip; and the IC module can perform the information exchange between the chip and a reader through electromagnetic coupling between the coupling micro antenna and the induction antenna and the electromagnetic coupling between the induction antenna and the induction coil of the reader. The invention solves the technical problem that the metal card hardly realizes double-interface chip clamping contact type function and a non-contact type communication function at the same time, and provides a new double-interface IC metal card which is good in touching, has metal texture and can realize a double-interface transaction function.

Description

technical field [0001] The invention belongs to the technical field of smart IC cards, and more specifically relates to a smart chip card capable of adopting contact and non-contact communication methods and a manufacturing method thereof. Background technique [0002] With the continuous development of smart card technology in recent years, all kinds of magnetic stripe cards and IC cards have been widely used in finance, medical care, public transportation, security systems, telephone communications, social security and other fields. In order to attract more customers to use their The issued cards have launched cards with different structures and styles. Distinguished by the communication method between the card and the card reader, the existing IC cards are mainly divided into two categories: contact IC cards that can write and read information by contacting special equipment, and those that can only be written by approaching special equipment And a non-contact IC card th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/08
Inventor 卢闰霆薄秀虎
Owner GOLDPAC GRP LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products