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Chip temperature predicating method based on ANSYS finite element heat analysis

A prediction method and thermal analysis technology, applied in special data processing applications, instruments, electrical and digital data processing, etc., can solve the problems of high cost, insufficient simplicity and convenience, and achieve the effect of convenient operation, simple operation and accurate results.

Active Publication Date: 2014-12-03
SYSU CMU SHUNDE INT JOINT RES INST +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Most of the measuring instruments used in traditional chip temperature measurement are infrared irradiators, and it is carried out after the chip tape-out is completed and made into a circuit PCB board. The temperature value measured by this method is true and effective, but once the temperature problem of the chip is found It is necessary to re-design the physical chip and tape it out, so the cost is relatively high, and it is not simple and convenient enough.

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  • Chip temperature predicating method based on ANSYS finite element heat analysis
  • Chip temperature predicating method based on ANSYS finite element heat analysis
  • Chip temperature predicating method based on ANSYS finite element heat analysis

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Embodiment 1

[0061] This embodiment illustrates the related theory of chip modeling using ANSYS finite element thermal analysis tool in the present invention.

[0062] (1) Finite element method

[0063] The basic principle of finite element analysis is to discretize the original continuous model body, that is, to decompose the continuous entity into a finite number of small unit blocks that are connected and regular in shape, and describe a certain physical characteristic through the hypothesis of each small unit block. Approximate functions are used to solve the functions of the entire model, thereby converting the original complex infinite degree of freedom problem into a limited degree of freedom problem, which simplifies the solution and is suitable for solving problems such as various complex models, complex boundary conditions, and complex material properties. The solution obtained by the finite element is not an exact value, but an approximate value, and its accuracy depends on the ...

Embodiment 2

[0084] This embodiment introduces the specific implementation process of the present invention.

[0085] A kind of specific implementation process of the chip temperature prediction method based on ANSYS finite element thermal analysis of the present invention is:

[0086] (1) Search for technical documents and determine the parameters required for chip modeling.

[0087] As shown in Table 1 below, the internal structure of the chip under this process is determined by searching the corresponding process library design documents, including the material thermal conductivity, specific heat capacity, density and geometry of each layer such as the device layer, metal layer, via layer, and passivation layer. thickness.

[0088] Table 1

[0089]

[0090] (2) Use ANSYS to create a geometric model of the internal structure of the chip.

[0091] According to the parameter values ​​in Table 1, the ANSYS thermal model is used to establish the geometric model of the internal structur...

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Abstract

The invention discloses a chip temperature predicating method based on ANSYS finite element heat analysis. The chip temperature predicating method comprise steps as follows: a chip interior structure solid model is established by ANSYS according to acquired chip model parameters; the chip interior structure solid model is subjected to finite element mesh generation; the heat generation rate and the boundary conditions are loaded, then, the chip interior structure solid model after finite element mesh generation is subjected to steady-state heat analysis, and the maximum temperature of a chip is obtained; the heat generation rate of the chip is changed, and the maximum temperature of the chip under different heat generation rates is acquired through steady-state heat analysis; the relation curve of the heat generation rate and the chip temperature is fitted, and a relation function of the heat generation rate and the chip temperature is obtained; and the actual heat generation rate is substituted into the relation function of the heat generation rate and the chip temperature, and the actual temperature of the chip is obtained. According to the method, the temperature predication is placed at the physical design stage of the chip, the cost is reduced and the operation is simple and convenient; and the method can be widely applied to the technical field of semiconductors.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a chip temperature prediction method based on ANSYS finite element thermal analysis. Background technique [0002] The development of semiconductor manufacturing technology has further reduced the size of the chip, and the density of devices on the chip has been further increased, so that more functions can be realized in a chip with a small area. But the problem that comes with it is that the operating temperature of the chip is getting higher and higher. Correspondingly, the service life of the chip has become the focus of attention. Research shows that the service life of the chip decreases exponentially with the temperature of the devices on the chip. [0003] Most of the measuring instruments used in traditional chip temperature measurement are infrared irradiators, and it is carried out after the chip tape-out is completed and made into a circuit PCB board. The temp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 陈弟虎粟涛杨茵
Owner SYSU CMU SHUNDE INT JOINT RES INST
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