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Electronic devices assembled with thermally insulating layers

A technology of consumer electronics and heat sink, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve unsatisfied problems

Inactive Publication Date: 2014-12-03
HENKEL IP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Until now, this need has not been met

Method used

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  • Electronic devices assembled with thermally insulating layers
  • Electronic devices assembled with thermally insulating layers
  • Electronic devices assembled with thermally insulating layers

Examples

Experimental program
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Effect test

Embodiment Construction

[0026] As noted above, a consumer electronic article is provided herein. The article (or "device") may be selected from a notebook PC, a tablet PC, or a handheld device, such as a music player, video player, still image player, game console, other media player, music recorder, video recorder , cameras, other media recorders, radios, medical equipment, household appliances, vehicle instruments, musical instruments, calculators, mobile phones, other wireless communication equipment, personal digital assistants, remote controls, pagers, monitors, televisions, stereo equipment, Set-top boxes, set-top boxes, portable cassette players, modems, routers, keyboards, mice, speakers, printers, and combinations thereof.

[0027] The equipment includes:

[0028] an enclosure comprising at least one substrate having an inner surface and an outer surface;

[0029] a layer of insulating elements disposed on at least a portion of the inner surface of the at least one substrate; and

[0030]...

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Abstract

Provided herein are electronic devices assembled with thermally insulating layers.

Description

technical field [0001] Provided herein is an electronic device equipped with a thermal barrier. Background technique [0002] As microelectronic circuits continue to shrink in size, and the capabilities of the circuits continue to increase in functionality, the heat generated by the circuits in use becomes more and more problematic for manufacturers and end users. In other words, the level of heat generated is related to the performance of the semiconductor package, where the more highly performing the device generates a higher level of heat. For example, semiconductor packages assembled on circuit boards within consumer electronic devices, such as those found in central and graphics processing units, chipsets, batteries, and voltage regulators, generate all the heat as a normal byproduct of operation . Semiconductor packages generate heat that needs to be managed to increase the life of the package, minimize design constraints and improve the performance of the package, a...

Claims

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Application Information

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IPC IPC(8): G06F1/20H05K7/20
CPCH01L23/36H01L2924/0002G06F1/182G06F1/20G06F1/203H01L2924/00
Inventor M·N·阮J·布兰迪
Owner HENKEL IP