A kind of active agent for lead-free solder paste and its preparation method and a kind of lead-free solder paste
A lead-free solder paste and active agent technology, used in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of low activity and intolerant storage, improve printing durability, reduce dosage, and improve wetting performance. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0023] The present invention provides an active agent for lead-free solder paste, its preparation method and a lead-free solder paste. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0024] The present invention provides a kind of preparation method of active agent for lead-free solder paste, wherein, described preparation method is:
[0025] After the organic acid and organic halide particles are crushed to a particle size below 10 μm, they are added to the wall material solution and fully emulsified to make microcapsule active particles as active agents for lead-free solder paste.
[0026] In a preferred embodiment, the organic acid is composed of a dicarboxylic acid with 4 to 10 even-numbered C atoms ...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com