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Lamination structure of circuit board with side grooves and manufacturing method of circuit board

A manufacturing method and circuit board technology, applied in the direction of multi-layer circuit manufacturing, printed circuit components, etc., can solve the problem of insufficient glue filling on the groove circuit surface, and achieve the effect of avoiding insufficient glue filling and uniform copper plating.

Active Publication Date: 2017-07-11
GUANGZHOU MEADVILLE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The second object of the present invention is to propose a method for making a circuit board with side grooves, which can solve the problem of insufficient glue filling on the circuit surface of the grooves

Method used

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  • Lamination structure of circuit board with side grooves and manufacturing method of circuit board
  • Lamination structure of circuit board with side grooves and manufacturing method of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] like figure 1 As shown, a laminated structure of a circuit board with side grooves, which includes a first copper foil layer 17, a first centrifugal film layer 13, a first aluminum sheet layer 14, a first core laminated from top to bottom plate, first NF PP 4, second core plate, second NF PP8, third core plate, second aluminum sheet 15, second centrifugal membrane 16 and second copper foil layer 18. A groove 12 is formed in the pressing structure of the circuit board through the first NF PP 4 , the second core board and the second NF PP 8 , and one side of the groove 12 communicates with the outside.

[0043] The first core board is provided with a conduction hole 19 , and the conduction hole 19 communicates with the groove 12 . The first core board includes a first-one insulating layer 2 and first-one copper foil layers 1 and 3 located on the upper and lower surfaces of the first-one insulating layer 2; the third core board includes a third one-insulation layer. laye...

Embodiment 2

[0056] In addition, copper plating regions can also be formed on the first first copper foil layer located on the lower surface of the first first insulating layer and the third first copper foil layer located on the upper surface of the third first insulating layer in the above embodiment. At this time, it means that the inner wall of the groove has copper plating requirements. First, adjust the groove design, extend the groove area from the open end of the side wall to the waste area, and design a drill hole in the waste area to make the drill hole and the groove conduct.

[0057] combine figure 2 As shown, the specific production method is as follows:

[0058] Step 1. Open the first NF PP 4, the second core board and the second NF PP8 respectively by punching and opening the window; the second core board includes the second first insulating layer 6 and The second-first copper foil layers 5, 7 located on the upper and lower surfaces of the second-first insulating layer 6; ...

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Abstract

The invention relates to a press fit structure of a circuit board with a side surface groove and a manufacturing method of the circuit board. The press fit structure of the circuit board comprises a first copper foil layer, a first centrifugal film layer, a first aluminum sheet layer, a first core plate, a first NF PP, a second core plate, a second NF PP, a third core plate, a second aluminum sheet layer, a second centrifugal film and a second copper foil layer; at least one groove penetrating through the first NF PP, the second core plate and the second NF PP is further formed in the press fit structure of the circuit board, and one side of the groove is communicated with the outside. The press fit structure of the circuit board with the side surface groove has the advantages that the composite layer of the copper foils, the centrifugal film and the aluminum sheets is adopted so that the rigidity of the material is guaranteed and the defect of depression of a large cavity can be solved instead of a steel plate, and the composite layer also has excellent buffer property of such materials as a press fit cushion or a press fit cushion combined with an auxiliary plate, and moreover, during wiring on a cavity plate, well union of the NF PPs and a circuit can be realized and defects such as insufficient filled glue can be avoided. As the same, when the inner wall of the groove needs to be copperized, the invention further provides a method for evenly copperizing the inner wall of the groove.

Description

technical field [0001] The invention relates to the technical field of circuit boards. Background technique [0002] In terms of space utilization, the electronics manufacturing industry has developed in multiple directions: light and thin materials, centralized and refined wiring density, miniaturized and dense via holes, and diversified assembly methods. In terms of diversification of assembly methods, when assembling and splicing special PCBs and special components with the mother board PCB, in order to reduce the occupied space, they are no longer satisfied with the traditional welding and mounting process, but are instead made on the PCB mother board. Specific function modules, embedded or semi-embedded in the motherboard. For example: buried components, buried copper block, buried sub-board design, embedded capacitor, resistor design, stepped board design, cavity board design, and side groove (cavity) board design, etc. [0003] The side groove plate process is a met...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46
Inventor 吴少晖唐立辉
Owner GUANGZHOU MEADVILLE ELECTRONICS