Glass plate which can be reduced in warping during chemical toughening
A glass plate, chemical technology, applied in the direction of thin material processing, transportation and packaging, etc., can solve the problem of flatness damage, achieve excellent flatness and reduce warpage
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Embodiment 1
[0184] Such as Figure 4 As shown in the schematic diagram, the glass produced by the float method of glass material A and glass material C is charged into a quartz tube 50 with a volume of 3.2 L, and after vacuuming the inside of the tube, 10% H 2 with 90% N 2 The mixed gas is used to fill the system. Introduce 10% H into the whole system at a flow rate of 1.6L / min 2 with 90% N 2 While heating the mixed gas for 3 minutes, the temperature of the glass plate 51 was raised. 10%H 2 with 90%N 2 The mixed gas is introduced from the gas introduction direction 53 and discharged along the gas discharge direction 54.
[0185] In the case of glass material A, the heated glass plate 51 is heated at 712° C. for 30 seconds, and in the case of glass material C, the heated glass plate 51 is heated at 800° C. for 30 seconds. The 4.0 mm gas introduction nozzle 52 blows HF or Freon at the concentration shown in Table 1 onto the glass plate 51 at a flow rate of 0.4 L / min. Then, introduce...
Embodiment 2
[0191] HF treatment was performed in the float tank in which the glass ribbon of the glass material C flowed.
[0192] The obtained glass with a plate thickness of 0.7 mm was cut into three pieces of 100 mm square, and the warpage of two diagonal lines of the part corresponding to the 90 mm square part of the substrate was measured, and the average value thereof was regarded as the warpage amount before strengthening . In addition, the surface Na obtained by XRF analysis on one surface of the glass was measured. 2 O amount, surface Na on the other surface 2 O content and its mass % difference (ΔNa 2 O amount). Then, the glass was heated to 435 °C in KNO 3 Chemical strengthening by immersion in molten salt for 4 hours. Next, the warpage of two diagonal lines of the part corresponding to the 90 mm square part of the board|substrate was measured, and the average value was made into the warpage amount after strengthening.
[0193] The results are shown in Table 2. In additi...
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