Power module substrate with heat sink, and method for producing power module substrate with heat sink

A technology of a power module and a manufacturing method, which is applied in the field of manufacture of a substrate for a power module with a self-contained heat sink and a substrate for a power module with a self-contained heat sink, can solve the complex brazing operation and the reliability of bonding between a ceramic substrate and a metal plate. Problems such as drop, achieve the effect of excellent bonding reliability

Active Publication Date: 2014-12-10
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] However, there is a problem that the brazing work becomes complicated due to the use of flux
In addition, as described above, when flux is used for bonding the power module substrate and the heat sink, part of the flux compon

Method used

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  • Power module substrate with heat sink, and method for producing power module substrate with heat sink
  • Power module substrate with heat sink, and method for producing power module substrate with heat sink
  • Power module substrate with heat sink, and method for producing power module substrate with heat sink

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Experimental program
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Effect test

Embodiment

[0109] Hereinafter, the results of confirmation experiments conducted to confirm the effects of the present invention will be described.

[0110] As shown in Table 1, an insulating substrate, an aluminum plate as a circuit layer, and an aluminum plate as a metal layer were bonded to produce a power module substrate.

[0111] The bonding of the aluminum plate and the insulating substrate as the circuit layer, and the bonding of the insulating substrate and the aluminum plate as the metal layer was implemented under the following conditions. The aluminum plate as the circuit layer, the insulating substrate, and the aluminum plate as the metal layer are laminated through the solder foil of Al-10 mass % Si, and the aluminum plate is laminated at 5 kgf / cm in the lamination direction. 2 In a pressurized state, they were placed in a vacuum heating furnace and heated at 650° C. for 30 minutes to join them.

[0112] A1100 used for the metal layer in Table 1 is aluminum having an Al pu...

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PUM

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Abstract

This power module substrate with a heat sink is provided with a power module substrate having a circuit layer disposed on one surface of an insulating layer, and a heat sink joined to the other surface of the power module substrate. The joining surface of the heat sink and the joining surface of the power module substrate are each composed of aluminum or an aluminum alloy. A joining layer (50), obtained by dispersing a magnesium-containing compound (52) (excluding magnesium oxide) containing magnesium in an aluminum-silicon eutectic structure, is formed on the joining surfaces of the heat sink and the power module substrate, and the thickness (t) of the joining layer (50) is set within a range of 5 mum to 80 mum.

Description

technical field [0001] The present invention relates to a substrate for a power module with a heat sink and a method for manufacturing a substrate for a power module with a heat sink, in which the bonding surface of a heat sink and the bonding surface of a substrate for a power module are respectively made of aluminum or an aluminum alloy. [0002] This application claims priority based on Patent Application No. 2012-083247 for which it applied in Japan on March 30, 2012, and uses the content here. Background technique [0003] As the substrate for a power module with a heat sink, for example, substrates disclosed in Patent Documents 1 to 3 are proposed. [0004] In the power module substrates with heat sinks described in Patent Documents 1 and 2, the power module substrate and the aluminum heat sink are joined by brazing using an Al-Si-based brazing material. It is formed by bonding Al (aluminum) metal plates (circuit layer and metal layer) to both surfaces of a ceramic su...

Claims

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Application Information

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IPC IPC(8): H01L23/36
CPCH01L23/3735H01L23/473H01L23/4006H01L2224/32225C04B37/026C04B2235/6584C04B2237/121C04B2237/128C04B2237/343C04B2237/366C04B2237/368C04B2237/402C04B2237/704C04B2237/706C04B2237/86B23K1/0016B23K35/286B23K35/0222B23K35/0233B23K35/0238H01L24/29H01L24/32H01L2224/29111H01L2924/01047H01L2924/014H01L2924/01049H01L2924/01029H05K7/209
Inventor 长友义幸石塚博弥长濑敏之黑光祥郎江户正和三宅秀幸
Owner MITSUBISHI MATERIALS CORP
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