A circuit board and a manufacturing method thereof

Abstract

The invention provides a circuit board, which comprises a dielectric layer, a first conductive circuit layer and a second conductive circuit layer. The first conductive circuit layer and the second conductive circuit layer are formed on the two opposite sides of the dielectric layer. The first conductive circuit layer is in part embedded in the dielectric layer, and in part protrudes from the dielectric layer, while the second conductive circuit layer is formed on the surface of the dielectric layer. The invention also provides a manufacturing method of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board and a production method thereof. Background technique [0002] In the prior art, a build-up method or a semi-additive method is usually used in the manufacturing process of the circuit board, so that the obtained conductive lines are fabricated on the surface of the dielectric layer. That is, all the conductive lines protrude from the surface of the dielectric layer. In order to protect the conductive circuit, it is usually necessary to form a solder resist layer on the surface of the conductive circuit. The solder resist layer is usually formed by printing solder resist ink. When the solder resist layer is formed by printing, the solder resist layer needs to be formed to cover the conductive lines to be covered and the gaps between the conductive lines. Since the conductive circuit layer itself has a thickness, the thickness of the solder resis...

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Problems solved by technology

When the thickness of the wire circuit is large, the thickness of the formed solder resist layer also needs to be increased, which is not conducive to the thinning of the circuit board.

[0003] Moreover, the manufacturing method of the conductive circuit in the prior art is also unfavorable for the manufacture of the thin circuit.

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