Semiconductor device, die attaching material, and method for manufacturing semiconductor device

A technology for bonding materials and semiconductors, applied in the direction of semiconductor devices, adhesive types, ester copolymer adhesives, etc., can solve the problems of easy coloring, low elastic modulus, poor adhesion, etc., and achieve high light reflectivity, The effect of high discoloration resistance

Inactive Publication Date: 2014-12-17
SUMITOMO BAKELITE CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Silicone resin-containing die attach paste is excellent in colorlessness and high resistance to discoloration, but has the disadvantage of poor adhesion
Die attach paste containing epoxy resin has excellent adhesion, but has the disadvantages of easy coloring and low discoloration resistance
Die attach paste containing acrylic resin, although excellent in light reflectivity, has disadvantages of poor adhesion and low elastic modulus

Method used

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  • Semiconductor device, die attaching material, and method for manufacturing semiconductor device
  • Semiconductor device, die attaching material, and method for manufacturing semiconductor device
  • Semiconductor device, die attaching material, and method for manufacturing semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5、 comparative example 1～3

[0158] The components shown in Table 1 were blended, kneaded using a 3-roll machine, and a die-attach paste was obtained after defoaming.

[0159] [Table 1]

[0160]

[0161] The abbreviations in Table 1 have the following meanings. In addition, the compounding quantity of each component is weight%. In addition, each component used in the Example and the comparative example is as follows.

[0162] (A)-1: Tris(2-hydroxyethyl)isocyanurate triacrylate (trade name: SR-368, manufactured by Sartomer Company, Inc.).

[0163] (A)-2: Pentaerythritol triacrylate hexamethylene diisocyanate polyurethane prepolymer (trade name: UA-306H, manufactured by Kyoeisha Chemical Co., Ltd.).

[0164] (A)-3: Tricyclodecane dimethanol diacrylate (trade name: A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).

[0165] (A)-4: Bisphenol F type epoxy resin (trade name: SB-403S, produced by Nippon Kayaku Kogyo Co., Ltd.)

[0166] (A)-5: m-p-cresol glycidyl ether (trade name: m,p-CGE...

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Abstract

A semiconductor device (10) which comprises a substrate (1), an adhesive layer (2) and a light emitting diode chip (3), and wherein the adhesive layer (2) is a cured product of a die attaching material that contains (A) at least one kind of resin component that is selected from the group consisting of (A1) compounds represented by general formula (1) and (A2) acrylate compounds that have a cycloalkylene group and two or more (meth)acryl groups in each molecule but do not have an aromatic ring, (B) a silane coupling agent and (C) an inorganic filler. (In the formula, X represents an oxygen or nitrogen atom; each of m and n is 0 or 1; and each of R1, R2, R3 and R4 represents a hydrogen atom or an organic group that does not have an aromatic ring. In this connection at least two moieties among R1, R2, R3 and R4 are organic groups having a (meth)acryl group.)

Description

technical field [0001] The present invention relates to a semiconductor device, a die attach material and a method of manufacturing the semiconductor device. Background technique [0002] In recent years, light-emitting diodes (LEDs) have been used as low-power LEDs (less than 0.3W / mK) or medium-power LEDs (0.3~ 0.5W / mK) are used in various fields. In addition, further expansion of application fields such as use of high-power LEDs (over 0.5W / mK) such as automobile headlights is expected in the future. [0003] LEDs are usually used in the form of an LED package by bonding LED chips to a substrate or a lead frame with a chip-bonding paste. [0004] Various materials are conventionally known as a die-bonding paste used for a semiconductor device (for example, refer patent documents 1-3). However, as a die attach paste for LEDs, in order to maximize the characteristics of LEDs, it is required to have the following characteristics. [0005] (1) High light reflectivity [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48C08F2/44C09J4/02C09J11/04C09J11/06
CPCC08F2/44C09J4/00C09J11/04C09J11/06H01L33/48H01L33/56H01L33/486H01L2933/0033H01L24/29H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2924/10253H01L2924/00014H01L24/32H01L24/48H01L24/73H01L2224/2929H01L2924/12041H01L24/83H01L24/85H01L2224/83439H01L2224/83855H01L2224/92247H01L2924/181C08K5/5419H01L2924/00012H01L2924/00H01L2224/45099C08K3/22C08K3/36C08K2003/2227C09J133/14
Inventor 牧原康二刘瑞胜文玲心
Owner SUMITOMO BAKELITE CO LTD
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