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Method and system for verifying forecast simulation model of vibration fatigue life of micro assembly component

A technology of micro-assembly components and vibration fatigue, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve the problems of not fully reflecting the accuracy of the finite element model and low verification accuracy

Active Publication Date: 2014-12-24
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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Problems solved by technology

[0004] The traditional verification method of the vibration fatigue life prediction simulation model of metal components only extracts the modal parameters of the finite element model for verification, which cannot fully reflect the accuracy of the finite element model
There is a shortcoming of low verification accuracy when the traditional simulation model verification method for vibration fatigue life prediction of metal components is directly applied to micro-assembled components

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  • Method and system for verifying forecast simulation model of vibration fatigue life of micro assembly component

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Embodiment Construction

[0021] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describin...

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Abstract

The invention relates to a method and a system for verifying a forecast simulation model of the vibration fatigue life of a micro assembly component. The method comprises the following steps of building a vibration simulation finite element model according to the structures of the micro assembly component and a fixed part; extracting constraint mode characteristic parameters and random vibration response characteristic parameters of the vibration simulation finite element model, carrying out a mode test and a random vibration test on the micro assembly component, and acquiring constraint mode characteristic verification parameters and random vibration response characteristic verification parameters of the micro assembly component; judging whether the error of the acquired two groups of parameters is less than a corresponding preset threshold value, if yes, finishing the verification, if not, correcting the vibration simulation finite element model, and extracting constraint mode characteristic parameters and random vibration response characteristic parameters of the corrected vibration simulation finite element model again. According to the method, the random vibration response characteristic verification which has a load with the same magnitude as the fatigue life forecast random vibration is increased, so that the vibration simulation finite element model obtained through verification is closer to an actual use status, and the accuracy of model verification is improved.

Description

technical field [0001] The invention relates to the technical field of life prediction of electronic devices, in particular to a method and system for verifying a vibration fatigue life prediction simulation model of a micro-assembled component. Background technique [0002] With the development of science and social progress, the requirements for the integration of electronic products are getting higher and higher. Micro-assembly components refer to high-density integrated functional devices that encapsulate electronic components with metal and other materials, which can protect the electronic components in them from atmospheric water vapor corrosion. [0003] Since micro-assembly components usually need to be installed on fixtures such as PCB (Printed Circuit Board, printed circuit board) boards in practical applications, and the fixtures are non-rigid materials and large in size, micro-assembly may be caused by resonance of the fixtures. The synchronous resonance of comp...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 何小琦宋芳芳朱军华恩云飞李勋平
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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