Component embedded package structure and its manufacturing method

Abstract

The invention relates to a component embedded packaging structure and a manufacturing method thereof. The component embedded package structure includes: a substrate having a first surface and a second surface opposite to the first surface, and a through hole extending from the first surface to the second surface; A permanent interconnect extending from the first surface to the second surface; a first patterned conductive layer is disposed on the first surface; a second patterned conductive layer is disposed on the second surface, transparent Electrically connected to the first patterned conductive layer through the first electrical interconnection; at least one die is disposed in the through hole, the die has an active surface and an active surface relative to the active surface a backside, the backside of the die is exposed on the second surface of the substrate; a first dielectric layer, filling the gap between the die and the sidewalls of the vias and covering the die The active surface of the substrate and the first surface of the substrate; the third patterned conductive layer is disposed on the surface of the first dielectric layer, electrically connected to the die through the second electrical interconnection connections; and a metal layer disposed directly on the backside of the die.

Description

technical field [0001] The present invention relates to a semiconductor package and its manufacturing method. Background technique [0002] In response to the demand for small size and performance of electronic products, the design of the key components of electronic products, that is, semiconductor elements, is becoming more and more complex and required to be more miniaturized. Generally speaking, semiconductor components are mounted on a substrate containing circuits and then packaged. However, in this way, the space on the substrate is partially occupied by the semiconductor package, reducing the possibility of further stacking chips. Therefore, the current technology research and development direction is towards embedding components in the substrate to reduce the space occupied by semiconductor components on the substrate and simplify the assembly process. However, since the semiconductor element is embedded in the substrate, its heat dissipation effect becomes a diff...

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Problems solved by technology

However, since the semiconductor element is embedded in the substrate, its heat dissipation effect becomes a thorny issue

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