Semiconductor device and manufacturing method thereof

A manufacturing method, semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as difficult mass production, increased cost, and long time

Active Publication Date: 2019-10-22
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, the oxidation treatment in this process takes a long time (24 hours), so it is difficult to mass-produce and the cost will inevitably increase

Method used

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  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] Hereinafter, embodiments according to the present invention will be described.

[0046] Instructions are given in the following manner.

[0047] 1. Semiconductor device and manufacturing method of the embodiment

[0048] 1-1. Structure of semiconductor device

[0049] 1-2. Manufacturing method as the aforementioned example

[0050] 1-3. Problems in the preceding examples

[0051] 1-4. Manufacturing method of the example

[0052] 1-5. Outline of Embodiments

[0053] 2. Modification

[0054] 3. The present invention

[0055] 1. Semiconductor and manufacturing method of the embodiment

[0056] 1-1. Structure of semiconductor device

[0057] Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

[0058] figure 1 is a schematic cross-sectional view of the semiconductor device 1 according to the embodiment.

[0059] First, as a premise, the semiconductor device 1 according to the embodiment is configured to ha...

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Abstract

The present invention relates to a semiconductor device and a method of manufacturing the same. The semiconductor device includes a first semiconductor electronic component, the first semiconductor electronic component includes a pad electrode, a solder bump, and a metal layer between the pad and the solder, and the metal layer between the pad and the solder configured to have an underlying metal layer and a main metal layer, the underlying metal layer is formed between the pad electrode and the solder bump and is connected to the pad electrode, and the main metal layer is formed on On the underlying metal layer, wherein the main metal layer has an eave portion at its outer edge. Thus, in the present invention, a decrease in the reliability of electrical and mechanical connections between semiconductor electronic elements is prevented while suppressing a decrease in mass productivity and an increase in cost.

Description

technical field [0001] The present invention relates to a semiconductor device and a manufacturing method thereof, and more particularly to the technical field of a semiconductor device having a predetermined metal layer disposed between a pad electrode and a solder bump. Background technique [0002] For example, with a known flip chip method or the like, an IC chip (semiconductor chip) is bonded (mounted) to a mounting substrate including a semiconductor substrate through solder bumps. In a semiconductor device in which a semiconductor chip is mounted on a mounting substrate by solder bumps, an under-bump metal (hereinafter, referred to as "UBM") is arranged between a pad electrode and a solder bump (for example, refer to Japanese Unexamined Examined Patent Application 2008-28112 and Japanese Unexamined Patent Application 2012-80043). The UBM is configured to improve the bond adhesion between the pad electrode (eg, Al-based material) and the solder bump. [0003] For exa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L2224/1146H01L2224/0558H01L24/03H01L24/05H01L2224/0345H01L2224/0346H01L2224/0347H01L2224/05541H01L2224/05557H01L2224/05647H01L2224/11462H01L2224/1181H01L2224/11849H01L2224/11903H01L2224/13007H01L2224/13018H01L2224/13082H01L2224/94H01L2924/3651H01L2224/03912H01L2224/13006H01L2224/11472H01L2224/11009H01L2224/05572H01L2224/03009H01L2224/0401H01L2224/05009H01L2224/05022H01L2224/05124H01L2224/05147H01L2224/05166H01L2224/1134H01L2224/0361H01L24/11H01L24/13H01L2924/00014H01L2924/00012H01L2924/207H01L2224/03H01L2224/11
Inventor 松本一治大鸟居英
Owner SONY CORP
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