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Both-way ESD protection device based on transverse PNP structure

A technology of ESD protection and devices, which is applied in the direction of electric solid-state devices, semiconductor devices, electrical components, etc., can solve the problems of large current leakage, high breakdown voltage of ESD protection devices, etc., and achieve the effect of improving flexibility

Active Publication Date: 2014-12-24
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, the design of an ESD protection device needs to consider two aspects: one is that the ESD protection device must be able to discharge a large current; low voltage level
However, in some special circuits and special applications, ESD protection devices need to have a higher breakdown voltage and a stronger current discharge capability, and at the same time, it is necessary to improve the bidirectional ESD protection capability to the ground terminal

Method used

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  • Both-way ESD protection device based on transverse PNP structure
  • Both-way ESD protection device based on transverse PNP structure
  • Both-way ESD protection device based on transverse PNP structure

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Embodiment Construction

[0023] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] A bidirectional ESD protection device based on a lateral PNP structure, comprising a P-type substrate 101, a first N-type well 102 is arranged in the P-type substrate, a second N-type well 103 is injected into the first N-type well 101 There is a first P+ implantation region 104, a second P+ implantation region 105, a first N+ implantation region 106, a second N+ implantation region 107, a third P+ implantation region 108, and a fourth P+ implantation region in the second N-type well 103. 109, wherein: the P-type substrate 101, the first N-type well 102 and the second N-type well 103 are all covered with an oxide isolation layer, and from left to right are the first oxide isolation layer 110, the second oxide isolation layer layer 111 , a third oxide isolation layer 112 , a fourth oxide isolation layer...

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Abstract

The invention discloses a both-way ESD protection device based on a transverse PNP structure. The both-way ESD protection device based on the transverse PNP structure can be used in an on-chip ICESD protection circuit. The both-way ESD protection device is mainly formed by a P-type substrate, a first N-type trap, a second N-type trap, a first P+ injection region, a second P+ injection region, a first N+ injection region, a second N+ injection region, a third N+ injection region, a fourth N+ injection region and a plurality of field oxygen isolation regions. According to the both-way ESD protection device in the type, under the forward or backward ESD pulse effect, a backward PN junction of the internal transverse PNP structure is triggered for connection, connection is achieved through a forward PN junction in another N trap at the same time, and an ESD electric current releasing path formed by connecting a transverse PNP transistor with a forward diode in series will be generated. The maintaining voltage of the device when forward or backward ESD pulses come can be singly changed by respectively stretching the base width of two PNPs, and the working flexibility of the device is improved.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit electrostatic discharge (ESD-Electrostatic Discharge) protection, and relates to a bidirectional ESD protection device based on a lateral PNP structure. Background technique [0002] The phenomenon of electrostatic discharge (ESD) widely exists in nature, and it is also one of the important reasons for the failure of integrated circuit products. Integrated circuit products are easily affected by electrostatic discharge during their manufacturing and assembly processes, resulting in reduced reliability or even damage to the product. Therefore, research on electrostatic discharge protection devices and protection circuits with high reliability and strong electrostatic protection performance has a non-negligible role in improving the yield and reliability of integrated circuits. [0003] According to the causes of electrostatic discharge and the different ways of discharging integrated ci...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/02
Inventor 纪长志刘志伟繆家斌刘聂张国彦刘毅杨雪娇田瑞刘凡
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA