Manufacturing method of fusing device
A technology of fuses and devices, which is applied in the field of preparation of fuse devices, can solve problems such as diode chip defects, and achieve the effects of reducing the number of times of exposure, eliminating defects, and reducing the number of times of corrosion
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[0036] Combining the above core ideas, the present invention provides a method for preparing a fuse device, comprising the following steps:
[0037] Step S01, providing a substrate, the substrate has a pad area and a fuse area, the pad area has a pad, and the fuse area has a fuse;
[0038] Step S02, preparing a passivation layer on the substrate;
[0039] Step S03 , removing part of the thickness of the passivation layer of the fuse region, so that the passivation layer above the fuse remains to a predetermined thickness;
[0040] Step S04 , selectively removing the passivation layer in the pad region to expose the pad.
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