Etching device and method
An etching device, directly above the technology, applied in the direction of electrical components, electrical solid devices, semiconductor/solid device manufacturing, etc., can solve the problems that SiCoNi by-products cannot be completely removed and the output is low, so as to improve the yield and output High, optimize the effect of etching process
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[0034] The present invention will be further described below with reference to the drawings and specific embodiments, but it is not a limitation of the present invention.
[0035] In order to optimize the etching process of the wafer and simultaneously perform the process production of multiple wafers, and to ensure that the by-products of the SiCoNi reaction chamber during the wafer etching process are completely removed, and the wafer yield rate is improved, the present invention Provide an etching device and method, such as figure 2 with image 3 Shown.
[0036] In the embodiment of the present invention, it relates to an etching device, which is specifically a SiCoNi reaction chamber with a number of pedestals. The SiCoNi etching technology in the reaction chamber is used to remove oxidation on the surface of a wafer. Silicon reduces the contact resistance; in addition, the number of pedestals in the SiCoNi reaction chamber specifically includes: a number of first pedestals, ...
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