a power device

Abstract

The invention provides a power device. The power device comprises chips, two electrodes, molybdenum plate sets, a ceramic package and short circuit structures. Each short circuit structure comprises a compressed metal spring, a sleeve arranged on the outer side of the metal spring in a sleeving mode and low-melting-point alloy packaging the metal spring inside the sleeve. The short circuit structures are arranged between the two electrodes. One end of each short circuit structure is connected with the inner side, close to the other electrode, of one electrode, and the other end of each short circuit structure is close to the inner side of the other electrode. When the metal springs are in a relaxed state, the two ends of the metal springs make contact with the inner sides of the two electrodes respectively. By the adoption of the short circuit structures, when the power device has a short circuit and emits heat, the low-melting-point alloy is melt, the metal springs restore the relaxed state and connect the two electrodes, as a result, a connection breakover structure is still arranged between the two electrodes even if the power device has a failure, it is guaranteed that the power device manifests as a short circuit failure mode, the power device does not need to be externally connected with a bypass thyristor, and the power device is simple in overall structure and easy to obtain.

Description

technical field [0001] The present invention relates to the field of electronic equipment, more specifically, to a power device. Background technique [0002] The schematic diagram of the structure of the flat crimping type power device is as follows: figure 1 As shown, it includes a chip 101, an upper molybdenum sheet 102, an upper electrode 103, a lower molybdenum sheet 104, a lower electrode 105 and a ceramic shell 106, etc., wherein the chip 101 is arranged between the upper molybdenum sheet 102 and the lower molybdenum sheet 104, and the upper electrode 103 is arranged on the upper molybdenum sheet 102 , the lower electrode 105 is arranged under the lower molybdenum sheet 104 , and the ceramic case 106 is arranged between the upper electrode 103 and the lower electrode 105 for packaging the power device. [0003] Due to the advantages of double-sided heat dissipation and short-circuit failure mode, the flat crimping power device is used in series applications, such as ...

AI Technical Summary

Problems solved by technology

[0007] In view of this, the present invention provides a power device, which solves the problem in the prior art that the overall structure of the power device becomes complicated due to the use of a structure in which the power device is externally connected to a bypass thyristor.

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