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Image sensor

一种图像传感器、光接收部的技术，应用在图像传感器领域，能够解决结构复杂等问题，达到散热性好、变形抑制的效果

Active Publication Date: 2015-01-14
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In the close-contact image sensor described in Patent Document 2, it is necessary to provide a holding frame separately from the frame so that the light irradiated by the LED chip does not directly enter the light-receiving sensor and sandwich the rod lens array. As a result, there is a structure complicated question

Method used

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Embodiment approach 1

[0047] Below, use Figure 1 ~ Figure 1 5. The image sensor S1 according to Embodiment 1 of the present invention will be described. figure 1 It is an exploded view of the image sensor S1 according to Embodiment 1 of the present invention. figure 2 This is an external view of the image sensor S1. image 3 It is a configuration diagram of the image sensor S1 viewed from the mounting side of the sensor substrate 17 . Figure 4A It is an exploded view of the light guides 1 and 2 and the holder 7 of the image sensor S1. Figure 4B It is an exploded view of the light guides 1 and 2 and the holder 8 of the image sensor S1. Figure 5A It is an exploded view of the light sources 3 and 5, the light source substrate 11, and the heat conductor 13 of the image sensor S1. Figure 5B It is an exploded view of the light sources 4 and 6, the light source substrate 12, and the heat conductor 14 of the image sensor S1. Image 6 It is an external view of the case metal part 110 of the image...

Embodiment approach 2

[0102] Next, use Figure 16 ~ Figure 21 , the image sensor S2 according to Embodiment 2 of the present invention will be described. Figure 16 It is a perspective view of the housing 10A of the image sensor S2 according to Embodiment 2 viewed from the irradiation side. Figure 17 It is a perspective view of the housing 10A of the image sensor S2 according to Embodiment 2 viewed from the back. Figure 18 It is a side view of the image sensor S2 according to the second embodiment.

[0103] The image sensor S2 according to the second embodiment differs from the image sensor S1 according to the above-mentioned first embodiment in that the structure of the housing 10A it has is different from the structure of the housing 10 described in the above-mentioned first embodiment.

[0104] like Figure 16 and Figure 17 As shown, the housing 10A is formed in a substantially rectangular parallelepiped shape whose longitudinal direction is the X-axis direction (main scanning direction)....

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Abstract

An image sensor (S1) is provided with the following: light guide bodies (1), (2) for projecting light to an object of irradiation; a lens (15) for focusing reflection light reflected to the object of irradiation; a sensor (16) for receiving the reflection light focused by the lens (15); and a housing (10). The housing (10) encloses and holds the light guide bodies (1), (2), the lens (15), and the sensor (16) and is integrally formed by a housing metal part (110) and a housing resin part (210).

Description

technical field [0001] The present invention relates to an image sensor used in image reading devices such as copiers and multifunction machines. Background technique [0002] The high precision and high resolution of the reading depth are being improved for the close-contact image sensors used in image reading devices such as copiers and MFPs. Therefore, the optical system of the contact image sensor requires a structure that defines the relative positional relationship among the document, the lens, and the sensor with high precision. In Japanese Patent Laid-Open No. H07-131585 (refer to Patent Document 1), a rod lens, a document surface glass, and a sensor are attached as optical elements to a high-precision member formed by extrusion molding of aluminum or press processing of a steel plate. The substrate is mounted so that the relative positional relationship can be specified with high precision. [0003] In addition, in the optical system of the contact image sensor, t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N1/028G06T1/00H04N1/19
CPCH04N1/02835H04N2201/02456H04N2201/02466H04N2201/0312H04N2201/03125H04N2201/02481H04N2201/03112H04N2201/0246H04N2201/02458H04N1/0318H04N2201/02483H04N2201/03133H04N2201/0081H04N2201/03141H04N2201/03145H04N2201/02462H04N2201/02464H04N1/02815H01L27/14627H04N1/1936H04N2201/0082H04N2201/0094
Inventor 大滨大辅藤内亚纪子松村清一伊藤笃今泉贤
Owner MITSUBISHI ELECTRIC CORP