Optical fingerprint sensor chip grating and manufacturing method thereof
A technology for fingerprint sensors and manufacturing methods, applied in optics, optical elements, diffraction gratings, etc., can solve the problems of low precision and complex structure, and achieve the effect of high precision and simple structure
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
specific Embodiment approach
[0024] Optical fingerprint sensor chip grating of the present invention, its preferred embodiment is:
[0025] The grating is directly generated on the wafer of the photosensitive unit of the optical fingerprint sensor chip, the photosensitive unit corresponds to the opening, and the circuit part is covered.
[0026] The opaque component of the grating is metal, and all the circuit parts are covered with metal.
[0027] The manufacturing method of above-mentioned optical fingerprint sensor chip grating of the present invention, its preferred embodiment is:
[0028] Include steps:
[0029] A. A transparent silicon dioxide film is generated by CVD (chemical vapor deposition) method on the wafer processed by the photosensitive unit of the optical fingerprint sensor chip;
[0030] B. Generate an opaque metal film by sputtering;
[0031] C. Use photolithography to expose the area that needs light transmission;
[0032] D. After dry etching, the metal in the light-transmitting a...
specific Embodiment
[0039] As shown in Figure 3-1 to Figure 3-5, the production method is as follows:
[0040] 1. SIO 2 - CVD - transparent silicon dioxide film;
[0041] 2. The method of sputtering to make metal;
[0042] 3. Photolithography;
[0043] 4. The method of dry etching etches away the metal corresponding to the photosensitive area;
[0044] 5.1 SOG protective film--transparent silicon dioxide by SPIN ON GLASS method;
[0045] 5.2 The SION produced by PECVD method is transparent silicon oxynitride, the protective film is anti-scratch, and the chip can be used directly.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 