Bubble removing structure for blind hole electroplating management groove of high-density interconnected circuit board

Abstract

The invention relates to a bubble removing structure for a blind hole electroplating management groove of a high-density interconnected circuit board. According to the bubble removing structure for the blind hole electroplating management groove of the high-density interconnected circuit board, multiple front baffles are installed on two side plates on the portion, between an inflating pipe and a liquid chemical inlet, of a groove body in a staggered and spaced mode respectively, a transverse S-shaped liquid chemical channel is formed by the multiple front baffles, multiple rear baffles are installed on the two sides of the portion, between a heating pipe and a liquid chemical outlet, of the groove body in a staggered and spaced mode respectively, and another transverse S-shaped liquid chemical channel is formed by the multiple rear baffles. According to the bubble removing structure for the blind hole electroplating management groove of the high-density interconnected circuit board, the front baffles and the rear baffles are arranged in the staggered mode, liquid chemical entering from the liquid chemical inlet flows in the two S-shaped channels, the flowing distance is increased, and thus gas in the liquid chemical can be discharged completely; two vertical baffles play a role in blocking, and the attraction of a spraying pump in a spraying system to residual bubbles in liquid chemical is reduced; due to the fact that the two measures are taken, liquid chemical entering the spraying system contains no bubble, and the blind hole electroplating quality is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of blind hole electroplating, in particular to a structure for removing air bubbles in a blind hole electroplating management groove of a high-density interconnected circuit board. Background technique [0002] In the manufacturing process of high-density interconnected circuit boards, the plating quality of blind holes is one of the most important performance indicators. The structure of the blind hole plating management groove involved is as follows: image 3 Shown: It includes tank body 2, drug inlet 1, gas pump 5, heating tube 7 and drug outlet 12. The drug solution enters the tank body through the drug inlet, and then flows through the gas pump and heating tube, and then flows out of the drug outlet. Flows into the sprinkler system in the main tank. In practice, it is found that blind hole electroplating often has the problem of thin copper in the hole. When customers are soldering, serious performance ...

AI Technical Summary

Problems solved by technology

In practice, it is found that blind hole electroplating often has the problem of thin copper in the hole. When customers are soldering, serious performance problems such as open circuit and high resistance occur due to thermal shock, resulting in huge economic losses for customers. After technical analysis, the main reasons are: Due to the existence of the gas pipe, the tiny air bubbles in the liquid medicine enter the spray system at the same time, and then enter the blind hole, hindering the exchange of the liquid medicine in the blind hole, and finally the problem of copper thinning occurs

Some manufacturers close the gas pipe, and some manufacturers install blocking plates in the tank, but the effect is not very good

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