A kind of low-melting point thermally bonded polyamide fiber filament and its preparation method
A polyamide fiber and thermal bonding technology, which is applied in the direction of single-component copolyamide artificial filament, melt spinning method, artificial filament heat treatment, etc., can solve the problem of low melting point thermal bonding fiber with insufficient strength and easy molecular structure Changes, poor uniformity of dyeing and coloring, etc., to achieve the effect of eliminating post-processing, easy bonding, and simple methods
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[0026] The present invention also provides a method for preparing the above-mentioned low-melting-point thermally bonded polyamide fiber filament, which includes the following steps:
[0027] Using copolyamide chips with a melting point of 75-95°C as raw material, they are extruded by a screw, and after side blowing, they are oiled to absorb moisture and enter the tunnel, and then pass through the first hot roller with a speed of 2150-2850m / min and a speed of 3200-4200m / min. 1.47-2.6 times the draft between the second heating roller and the third heating roller with a speed of 4200-5500m / min to obtain filaments;
[0028] Among them, the screw temperature during the screw extrusion process is 120-205°C, the temperature of the first heating roller is 50-80°C during the drawing and shaping process, the temperature of the second heating roller is 60-90°C, and the temperature of the third heating roller It is 80-110°C.
[0029] The invention provides a method for preparing low-melting th...
Embodiment 1
[0038] Using copolyamide chips with a melting point of 75°C as raw material, the raw material is dried at 50°C for 12 hours under the condition of a vacuum of -0.12Mpa;
[0039] Then the raw material is extruded by a screw, oiled and absorbed by the side blowing into the tunnel, and then passed through the first heat roller with a speed of 2150m / min, the second heat roller with a speed of 3200m / min and the third heat roller with a speed of 4500m / min. After 2.09 times of drafting between the rollers, fiber filaments are obtained;
[0040] Among them, the screw temperature during the screw extrusion process is 120-185°C, the temperature of the first heating roller is 55°C, the temperature of the second heating roller is 65°C, and the temperature of the third heating roller is 85°C during the drawing and setting process;
[0041] During the preparation method of the low melting point thermally bonded polyamide fiber filament, the ambient air and side air blowing temperature are both 20°...
Embodiment 2
[0044] Using copolyamide chips with a melting point of 75°C as raw material, the raw material is dried at 50°C for 12 hours under the condition of a vacuum of -0.12Mpa;
[0045] After passing through the first heating roller with a speed of 2250m / min, the second heating roller with a speed of 3200m / min and the third heating roller with a speed of 4200m / min, the filament is drawn by 1.86 times.
[0046] Among them, the screw temperature during the screw extrusion process is 120-185°C, the temperature of the first heating roller is 60°C, the temperature of the second heating roller is 70°C, and the temperature of the third heating roller is 90°C;
[0047] During the preparation method of the low melting point thermally bonded polyamide fiber filament, the ambient air and side air blowing temperature are both 18°C and the humidity is 80%.
[0048] The obtained low-melting thermal bonding copolyamide fiber filament has a melting point of 75° C., a strength of 3.0 cN / dtex, an elongation r...
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