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Method for increasing yield of stripping technology

A technology of stripping process and yield rate, which is applied in the field of photolithography process, can solve the problems of metal residue on the surface of photoresist, and achieve the effect of complete reaction, improved yield rate and sufficient reaction

Active Publication Date: 2015-01-28
SOLOREIN TECH
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Problems solved by technology

[0008] The purpose of the present invention is to provide a method for improving the yield of the stripping process, which can effectively solve the problem of metal residue on the surface of the photoresist, thereby significantly improving the yield of the process

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  • Method for increasing yield of stripping technology

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Embodiment Construction

[0027] As mentioned in the background section, in the current lift-off process, especially when there are steps on the substrate surface, the metal on the photoresist surface is not removed cleanly, which reduces the yield of the lift-off process. The inventors found that after metal deposition, a thin layer of metal connection is formed on the side of the photoresist, which will affect the contact reaction between the immersion solution and the photoresist, resulting in metal residues, thereby reducing the yield of the stripping process.

[0028] Based on the above research, an embodiment of the present invention provides a method for improving the yield of the stripping process, the method includes: coating a photoresist on the substrate; exposing the photoresist coated on the substrate, and A pattern with a negative bevel is developed on the photoresist; a metal layer is deposited on the photoresist remaining on the substrate after development and the surface of the substrat...

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Abstract

The embodiment of the invention discloses a method for increasing a yield of a stripping technology. The method comprises the steps of applying photoresist on a base, exposing the photoresist applied on the base, developing a negative beveled figure on the photoresist, retaining the photoresist and a surface deposition metal layer of the base exposed after the negative beveled figure is developed after developing, covering the metal layer with an adhesive film, removing the metal layer attached to the surface of the photoresist by uncovering the adhesive film in a preset direction, and removing the photoresist. The method for increasing the yield of the stripping technology can effectively remove the metal layer on the surface of the photoresist, and the yield is increased significantly.

Description

technical field [0001] The invention relates to the field of photolithography technology, in particular to a method for improving the yield of stripping technology. Background technique [0002] With the advancement of semiconductor technology, the corresponding product technology is also constantly developing, and the lift-off process is one of the important photolithography technology. [0003] Photolithography is one of the key processes for manufacturing integrated circuit graphics and microstructures. The so-called photolithography is to use the photochemical reaction of the photosensitive resist coating, combined with the corrosion method to prepare the required pattern on various thin films or silicon, so as to realize the production of various circuit components, selective doping, formation of metal electrodes and wiring, etc. Purpose. [0004] The photoresist used in the photolithography process is also called photoresist. It is a colloidal liquid made of a mixtur...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/42
Inventor 徐利辉李朝阳
Owner SOLOREIN TECH
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