MEMS (Micro Electro Mechanical System) temperature compensation operation circuit

Abstract

The invention relates to an MEMS (Micro Electro Mechanical System) temperature compensation operation circuit which comprises a multiplier, a summator and a storage unit. A temperature compensation and operation method adopted by the MEMS temperature compensation operation circuit comprises the following steps: (1), decomposing a binary five-order polynomial into a loop operation of addition before multiplication, to be specific, calculating each decomposed coefficient through the multiplier and the summator and storing all the coefficients in the storage unit; and (2) operating the binary five-order polynomial through the multiplier and the summator according to the decomposing process of the binary five-order polynomial and outputting an operation result. According to the operation circuit disclosed by the invention, the operation of a multielement high-order polynomial can be realized by the loop operation of the multiplier and the summator, the circuit area can be greatly saved, the operation reliability can be improved and the power consumption and cost are reduced.

Description

technical field [0001] The invention relates to a circuit for performing temperature compensation operation on MEMS. Background technique [0002] The multivariate high-order polynomial calculation in the MEMS temperature compensation system is complex, which may include signed numbers and decimals, and the calculation between signed decimals is more troublesome, which increases the difficulty of using semiconductor integrated circuits to realize polynomial operations. Most of them are realized by computing software or CPU, but rarely by hardware circuits. [0003] In the actual temperature compensation system, similar calculation software such as matlab cannot be used. However, if you want to realize the calculation of complex functions in the system, using DSP directly will cause waste of system resources. Or use a high-performance FPGA, and use the IP cores of addition, subtraction, and multiplication integrated in the FPGA to implement polynomial operations. However, ...

AI Technical Summary

Problems solved by technology

However, the implementation through FPGA is not only expensive, but also has a large area, which is not suitable for systems with strict area requirements.

[0004] At present, there is no solution for implementing MEMS temperature compensation polynomial calculations for semiconductor application-specific integrated circuits, and there is no calculation method for integrated circuit area optimization.

Images