A method for manufacturing a printed board with multi-layer soft and hard boards and impedance requirements

Abstract

The invention relates to a manufacturing method of a multi-layer soft-and-hard-plate combined printed board with an impedance requirement. The manufacturing method comprises the steps that an inner soft plate circuit is manufactured, and cover films are pressed on the two faces of a manufactured soft plate; PP sheet processing and copper foil and soft plate surface processing are carried out; the soft plate, the processed PP sheet and the copper foil are overlaid, and a false attaching machine is used for carrying out pre-pressing locating; a press-fit machine is used for pressing the soft plate, the processed PP sheet and the copper foil; an outer circuit is manufactured, and outer copper foil where circuits do not need to be manufactured is removed through etching. By means of the manufacturing method, the product yield can be greatly improved through process control and can reach more than 90%, and the product rejection rate is lowered to about 8%.

Description

technical field [0001] The invention relates to the technical field of FPC flexible boards, in particular to a method for manufacturing a printed board with a combination of soft and hard boards and impedance requirements. Background technique [0002] At present, electronic products are getting smaller and smaller, and more and more electronic products need to use printed boards that combine multi-layer soft boards and hard boards and have impedance requirements, especially in the field of communication. At present, printed boards that combine multi-layer soft boards and hard boards and have impedance requirements have very strict requirements on flexibility and reliability. The core production technology is monopolized by Japan, South Korea, Europe and other countries. Domestic FPC manufacturers produce this type of board. The technology is immature, the quality is unstable, the production pass rate is only about 50%, the scrap rate is over 30%, the production cost is very...

AI Technical Summary

Problems solved by technology

At present, printed boards that combine multi-layer soft boards and hard boards and have impedance requirements have very strict requirements on flexibility and reliability. The core production technology is monopolized by Japan, South Korea, Europe and other countries. Domestic FPC manufacturers produce this type of board. The technology is immature, the quality is unstable, the production pass rate is only about 50%, the scrap rate is over 30%, the production cost is very high, and mass production cannot be achieved

At present, most of this type of panels rely on imports, which greatly increases the burden on enterprises, resulting in increased costs and low profit margins.