Reflow soldering method of SMD (Surface Mounted Device) components

A technology of reflow soldering and patch components, which is applied in the direction of electrical components, welding equipment, printed circuit assembly of electrical components, etc., can solve the problems of energy waste, workpiece damage, uneven temperature, etc., and achieve faster cooling efficiency, effective welding, The effect of rapid cooling temperature drop

Inactive Publication Date: 2015-02-04
佛山市德艾光电科技有限公司
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Problems solved by technology

[0010] The technical problem to be solved by the present invention is: to provide a reflow soldering method for SMD LED lamps, which solves the problem of uneven temperature caused by continuous heating in the reflow soldering process in the prior art, and the high temperature in the reflow soldering area is easy to cause damage to the workpiece. The problem of wasting energy

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  • Reflow soldering method of SMD (Surface Mounted Device) components

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Embodiment Construction

[0030] The working process of the present invention will be further described below in conjunction with the accompanying drawings.

[0031] Such as figure 1 As shown, a method for reflow soldering of chip components comprises the following steps:

[0032] Step 1. The temperature of the preheating zone is raised, and the temperature of the preheating zone is controlled to increase at a slope less than or equal to 4°C / s, and the temperature increases to 150°C to 200°C;

[0033] Step 2. Wet the solder paste in the constant temperature zone, and keep the temperature between 150°C and 200°C for 60 to 100 seconds until the solder paste is completely melted;

[0034] Step 3. Reflow soldering in the reflow area, control the temperature to rise to the peak temperature within 25-30 seconds, and keep the peak temperature ±5°C for no more than 10 seconds;

[0035] Step 4, cooling in the cooling zone, controlling the temperature to decrease at a slope of 6°C / s or less until the temperatu...

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Abstract

The invention discloses a reflow soldering method of SMD (Surface Mounted Device) components. The method comprises the following steps: stopping heat when the temperature is increased for 80-90 DEG C during a heating process of a preheating region, keeping for 8-10 seconds, and continuously heating to 150-200 DEG C at a slope rate of 4 DEG C/S; and controlling the temperature of the heating region to increase at a slope rate less than or equal to 4 DEG C/S until the temperature increases to 150-200 DEG C; fully preheating a workpiece at 150-200 DEG C, so that impact of heat in the heating process is decelerated, residual heat is effectively utilized, the preheating efficiency is improved and energy sources are saved; and keeping the temperature within a range of a peak temperature+/-5 DEG C for not more than 10 seconds during a reflow soldering process of a reflow soldering region, reducing the temperature to the lower limit of a peak temperature range of 25-35 DEG C, and keeping for 10-20 seconds, so that workpiece damage caused by long-time continuous high temperature can be avoided and effective welding is achieved.

Description

technical field [0001] The invention belongs to the field of LED applications, and in particular relates to a reflow soldering method for chip components. Background technique [0002] General technical requirements and main forms of reflow soldering temperature curve: [0003] General technical requirements for each link of the reflow soldering temperature curve: Generally speaking, the reflow soldering temperature curve can be divided into three stages: preheating stage, reflow stage, and cooling stage. [0004] ① Preheating stage: Preheating refers to the heating behavior for the purpose of activating the tin water and avoiding the rapid high temperature heating during immersion tin, which will cause the parts to fail. Preheating temperature: set according to the type of solder paste used and the conditions recommended by the manufacturer. Generally, it is set in the range of 80-160°C to make it warm up slowly (the best curve); while for the constant temperature zone of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/00B23K3/08H05K3/34
CPCB23K1/0008B23K1/0016B23K1/20B23K2101/42H05K3/3468H05K3/3494H05K2201/10106H05K2203/043
Inventor 陈春旭张金民
Owner 佛山市德艾光电科技有限公司
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