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Improved direct writing forming method for preparing three-dimensional structure

A direct-writing molding and three-dimensional technology, which is applied to ceramic molding machines and manufacturing tools, can solve the problems of poor rheological properties of suspensions, difficulties in meeting the requirements of direct-writing molding, and needle nozzle clogging, and achieve good fluidity, Simple operation, overcome the effect of blocking the needle mouth

Active Publication Date: 2015-02-04
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the existing direct-writing forming process for preparing three-dimensional structures, the rheological properties of the suspension are not good, it is easy to cause needle nozzle blockage, and it is difficult to meet the defects of direct-writing forming. The purpose of the present invention is to provide a method using A method of preparing a three-dimensional structure of a suspension by direct writing molding. The rheological properties of the suspension used in this method can be controlled by temperature, and it is not limited by the type of powder material. Inorganic or organic three-dimensional structure of

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0041] Preparation of Si by Temperature Sensitive Dispersant 3 N 4 Temperature-sensitive suspension and forming millimeter-scale three-dimensional structures.

[0042] The temperature-sensitive dispersant polyethyleneimine-polyoxyethylene monomethyl ether PEI-g-PEO (total molecular weight is 30000, the molecular weight of PEO branched chain is 10000) (see Table 1 for specific addition) and Si 3 N 4 Powder (1000g, D50 is 10μm), sintering aid Y 2 o 3 (6g) and La 2 o 3 (2g) was added into 55mL deionized water for ball milling to prepare Si 3 N 4 Thermosensitive suspension. Wherein, the grinding balls are 1000g zirconia balls, the ball milling time is 16 hours, the ball milling speed is 10rad / min, and the ambient temperature of the ball milling is 10°C.

[0043] For the obtained Si 3 N 4 The temperature-sensitive suspension was filtered through a 100-mesh sieve, then vacuum stirred and degassed for 30 minutes, and then put into a 50mL syringe with a 1.54mm aperture need...

Embodiment 5

[0048] Preparation of ZrO by Temperature Sensitive Dispersant 2 Temperature-sensitive suspension and forming micron-scale three-dimensional structure.

[0049] The temperature-sensitive dispersant polyacrylic acid-polyoxyethylene monomethyl ether (PAA-b-PEO) (3g, the total molecular weight is 20000, the molecular weight of the PEO block is 8000) and Y 2 o 3 Stable ZrO 2 Powder (150g, D50 is 1μm) was added into 10mL deionized water for ball milling to prepare ZrO 2 Thermosensitive suspension. Wherein, the grinding balls are 200 g zirconia balls, the ball milling time is 18 hours, the ball milling speed is 30 rad / min, and the ambient temperature of the ball milling is 8°C.

[0050] For the obtained ZrO 2 The temperature-sensitive suspension was filtered through a 500-mesh sieve, then vacuum stirred and degassed for 40 minutes, and then put into a 10mL syringe with a 200μm aperture needle. The temperature for all operations was controlled at around 15°C. Direct writing mol...

Embodiment 6

[0053] Preparation of ZrO by Temperature Sensitive Dispersant 2 Temperature-sensitive suspension and forming micron-scale three-dimensional structure.

[0054] The temperature-sensitive dispersant polyacrylic acid-polyoxyethylene monomethyl ether (PAA-b-PEO) (4g, the total molecular weight is 10000, and the molecular weight of the PEO block is 1000) and Y 2 o 3 Stable ZrO 2 Powder (200g, D50 is 0.5μm) was added into 12mL deionized water for ball milling to prepare ZrO 2 Thermosensitive suspension. Wherein, the grinding balls are 250 g zirconia balls, the ball milling time is 24 hours, the ball milling speed is 50 rad / min, and the ambient temperature of the ball milling is 12° C.

[0055] For the obtained ZrO 2 The temperature-sensitive suspension was filtered through a 1000-mesh sieve, then vacuum stirred and degassed for 60 minutes, and then put into a 10mL syringe with a 100μm aperture needle. The temperature for all operations was controlled at around 12°C. Direct wr...

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Abstract

The invention discloses an improved direct writing forming method for preparing a three-dimensional structure. The method has the advantages that an aqueous solution, a temperature sensitive polymer or a temperature sensitive dispersant, a powder material and the like are subject to ball milling, so as to prepare temperature sensitive suspension liquid with good low-temperature fluidity and good high-temperature forming property; the temperature sensitive suspension liquid is subject to direct writing forming to prepare a blank, and the blank is further subject to heat treatment or debinding and sintering, so as to obtain the three-dimensional structure; the temperature change property of the temperature sensitive suspension liquid selected by the method is not related to the type of the powder material, various organic or inorganic materials can be selected to prepare the three-dimensional structure through the direct writing forming way, and the defect of easiness in blockage of a needle nozzle caused by the original suspension liquid in the direct writing forming process is overcome by the temperature change suspension liquid; meanwhile, the three-dimensional structure with accurate structure and large dimension can be prepared according to the design, and the decimeter-level, centimeter-level, millimeter-level, micrometer-level or nanometer-level three-dimensional structures can be prepared according to the selection of different powder materials or needle nozzles with different hole diameters.

Description

technical field [0001] The invention relates to an improved direct-writing molding method for preparing a three-dimensional structure, belonging to the field of preparation of three-dimensional structure materials. Background technique [0002] Complex three-dimensional structures are widely used in the design and preparation of advanced ceramic materials, composite materials, tissue engineering scaffolds and photonic materials. Therefore, simple and easy-to-control direct write assembly technologies such as 3D printing, fused deposition and direct ink writing (DIW) are also being used more and more. In the forming of three-dimensional structures [K.K.B.Hon, L Li, I.M.Hutchings.Direct writing technology—advances and developments.CIRP Annals-Manufacturing Technology.2008,57(2):601-620]. Among them, the three-dimensional structure formed by direct writing has a large aspect ratio and a size control range (from 10 -6 to 10 0 m) and other advantages, and can form complex thre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28B1/00B29C67/00B22F3/22
CPCB22F3/22B28B1/001B29C67/00
Inventor 周科朝王小锋张斗马超
Owner CENT SOUTH UNIV
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