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Winding core and roll

A core and coil technology, applied in the direction of film/sheet adhesives, adhesives, etc., can solve the problems of die-bonding film and dicing tape height difference, transfer marks, etc., to prevent winding offset, improve Reliability and effect of suppressing transfer marks

Active Publication Date: 2015-02-04
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Therefore, there is a problem that when the dicing-die-bonding integrated tape is wound on the core, these height differences are transferred to the die-bonding film and the dicing tape, and transfer traces of the height difference are generated on the die-bonding film and the dicing tape.

Method used

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  • Winding core and roll
  • Winding core and roll
  • Winding core and roll

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0083] As the adhesive tape, a dicing-die-bonding integrated tape manufactured by Hitachi Chemical Industries, Ltd. under the trade name "FH-4013 series" was used. As the first adhesive layer, a die-bonding film with a diameter of 320 mm and a layer thickness of 135 μm was formed, and as the second adhesive layer, a dicing tape with a diameter of 370 mm and a layer thickness of 120 μm was formed. In addition, the discrete distance between the outer edge of the first adhesive layer and the outer edge of the second adhesive layer was 25 mm, and the distance between the adhesive layers was 378 mm.

[0084] As the core, an ABS resin core having an outer diameter of 100 mm and an outer peripheral length of 314 mm was produced using ABS resin. One pitch of the pressure-sensitive adhesive layer was formed into about one roll, and the above-mentioned pressure-sensitive adhesive tape was wound around the prepared winding core to obtain a roll material. The winding tension at the time ...

Embodiment 2

[0088] The conditions were the same as in Example 1 except that the outer diameter of the winding core was 114 mm.

[0089] In the adhesive tape wound around the core, at least up to the tenth layer, the amount of deviation of the adhesive layer in the circumferential direction of the core between the inner tape portion and the outer tape portion is 1.1 mm or less.

[0090] Furthermore, the evaluation of the transfer mark and the evaluation of the winding deviation were carried out in the same manner as in Example 1. The evaluation results are shown in Table 1 below.

Embodiment 3

[0092] The conditions were the same as in Example 1 except that the outer diameter of the winding core was 120 mm.

[0093] In the adhesive tape wound on the core, at least up to the tenth layer, the amount of deviation of the adhesive layer in the circumferential direction of the core between the inner tape portion and the outer tape portion is 16.8 mm or less.

[0094] Furthermore, the evaluation of the transfer mark and the evaluation of the winding deviation were carried out in the same manner as in Example 1. The evaluation results are shown in Table 1 below.

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Abstract

The present invention pertains to a cylindrical winding core around which an adhesive tape is wound in multiple layers, said adhesive tape having an adhesive layer formed on a long base film in the longitudinal direction of the base film. When the adhesive tape has been wound around the core, the outer diameter of the core has a dimension in which the amount that the adhesive layer shifts in the circumferential direction of the core between an inside tape section and an outside tape section of the adhesive tape adjacent to the core in the radial direction is not more than 55 mm.

Description

technical field [0001] The present invention relates to a core for winding an adhesive tape, and a coil obtained by winding the adhesive tape on the core. Background technique [0002] Semiconductor devices are manufactured by dicing (dicing) a wafer into chips and bonding the diced chips to a substrate or the like. In the manufacture of such a semiconductor device, a dicing tape for supporting the diced chips when dicing (dicing) the wafer into chips, and a die-bonding film for bonding the diced chips are used. [0003] In recent years, a dicing-die-bonding integrated type tape having both the function of such a dicing tape and the function of a die-bonding tape has been developed (for example, refer to Patent Document 1). [0004] In the dicing-die-bonding integrated tape described in Patent Document 1, a die-bonding film is laminated on a release film, and a dicing tape is laminated on the die-bonding film. Furthermore, in order to adhere the dicing tape to a ring frame...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J7/20
CPCC09J7/02C09J7/20B65H75/10C09J2203/326
Inventor 小玉惠德安孝宽管井颂太
Owner RESONAC CORP