Encapsulation method and encapsulation equipment for OLED display panel

A technology for a display panel and a packaging method, which is applied in the manufacturing of electrical components, electrical solid-state devices, semiconductor/solid-state devices, etc., can solve problems such as affecting the yield of laser sintering, and achieve the effects of improving reliability, yield, and strength.

Active Publication Date: 2015-02-18
HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantage of the existing packaging method is that the interior of the display panel must maintain a high vacuum environment, otherwise the glass glue 30 on the packaging cover plate 20 cannot be in close contact with the display substrate 10, which will affect the laser sintering yield

Method used

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  • Encapsulation method and encapsulation equipment for OLED display panel
  • Encapsulation method and encapsulation equipment for OLED display panel
  • Encapsulation method and encapsulation equipment for OLED display panel

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Embodiment Construction

[0043] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments.

[0044] Please refer to figure 2 and image 3 Embodiment 1 of the present invention provides a packaging device for an OLED display panel, the packaging device is used for packaging an OLED display panel, and the display panel includes a first substrate 101 and a second substrate 102 with a glass glue 30 attached thereto. Glass glue 30 is located between the first substrate 101 and the second substrate 102, and the packaging device includes:

[0045] support abutment 201;

[0046] A flexible film 202, the size of the flexible film 202 is larger than the size of the display panel;

[0047] The air extraction unit 203 is used to extract the air between the support base 201 and the flexible film 202, so that the flexible film 202 is attached to the displ...

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PUM

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Abstract

The invention provides an encapsulation method and encapsulation equipment for an OLED display panel. The encapsulation method is used for encapsulating the OLED display panel. The display panel comprises a first substrate and a second substrate adhered with glass glue; the glass glue is positioned between the first substrate and the second substrate. The encapsulation method comprises the steps of arranging the display panel between a supporting base table and a soft thin film, wherein the size of the soft thin film is greater than that of the display panel; extracting air between the supporting base table and the soft thin film, wherein the soft thin film is attached to the display panel and the supporting base table, and a closed space is formed between the soft thin film and the supporting base table, furthermore, the soft thin film pressurizes the display panel in the closed space to enlarge the contact area between the glass glue and the first substrate; heating the glass glue with laser. According to the encapsulation method and the encapsulation equipment, the soft thin film is used for pressurizing the display panel, so that the contact area between the glass glue and the first substrate can be enlarged; therefore, when the glass glue is heated by laser, the sintering yield can be increased.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging method and packaging equipment for an OLED (Organic Light Emitting Diode) display panel. Background technique [0002] Please refer to figure 1 , the existing AMOLED (Active Matrix Organic Light Emitting Diode) panel packaging method is usually: the packaging cover plate 20 with glass glue 30 and the display substrate 10 supporting the organic light emitting diode (OLED) device 11 are placed in a vacuum environment The display panel is formed on the box, and then the sealing glue 40 is used to make the inside of the display panel reach a vacuum environment. When the display panel is placed in an atmospheric environment, the external atmosphere will pressurize the packaging cover plate 20 and the display substrate 10, making the glass The glue 30 is in close contact with the display substrate 10, and then the glass glue is heated by a laser to complete the packagin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L51/56
CPCH01L21/56
Inventor 张家豪
Owner HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD
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