Wireless sensor node shell resistant to high-temperature and high-humidity environment

Abstract

The invention discloses a wireless sensor node shell resistant to a high-temperature and high-humidity environment. A heat insulation and absorption means is used for enabling an internal circuit to work at a proper temperature, and therefore the working stability of a node is improved, and the service life of the node is prolonged. The node shell is divided into an inner layer and an outer layer; the outer layer is made of plastic low in heat conduction coefficient, the outer surface of the outer layer is coated with heat reflecting paint, and environment heat absorption is reduced as much as possible; the inner layer is a square heat storing box which is made of metallic aluminum high in heat conduction coefficient, the wall of the box is hollow and is provided with a cavity, the cavity is filled with phase-change heat absorbents with a proper melting point, internal produced working heat is absorbed, drying agents are placed in a clamped mode, and heat and humidity are absorbed. The temperature in the node is maintained at a specific value through the means of external blocking and internal absorbing, reliability and stability are higher, the phase-change heat absorbing mode is adopted, limited energy originally owned by the node cannot be consumed while the temperature is lowered and the humidity is removed, and the wireless sensor node shell is particularly suitable for high-temperature and high-humidity environments such as a greenhouse which has limited node energy.

Description

technical field [0001] The patent of the present invention relates to a wireless sensor node shell, more specifically, it relates to a wireless sensor node shell that can withstand high temperature and high humidity environment, and is suitable for use as a wireless node in a high temperature and high humidity environment such as a greenhouse. Background technique [0002] With the advancement of technology, nodes continue to develop towards miniaturization. According to Moore's Law, when the price remains unchanged, the number of transistors that can be accommodated on an integrated circuit will double every 18 months, and the performance will also increase by one. times. However, with the increase in the number of transistors and the increase in operating frequency, the heat generated by the instrument is also increasing, and the development of miniaturization requires integrated circuits to work in a narrower space, which further hinders the dissipation of heat. A large ...

AI Technical Summary

Problems solved by technology

There are improved node shells, which make the nodes cylindrical or even circular to increase the heat dissipation area, or paste reflective film on the surface of the shell to reduce the heat of the nodes. Although these measures are effective to a certain extent, the starting point is still to dissipate heat outward , which determines that the internal temperature of the node must be higher than the ambient temperature, so it is not suitable for high-temperature and high-humidity environments

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