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Baking system in LED (Light Emitting Diode) packaging

An LED packaging and oven technology, which is applied in the field of baking systems, can solve problems such as uneven oven temperature, and achieve the effects of improving baking effect, performance, and baking speed and efficiency.

Inactive Publication Date: 2015-03-04
WUXI WISEN INNOVATION TECH
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0015] The technical problem to be solved by the present invention is to provide a baking system in LED packaging, which solves the problem of uneven temperature in each temperature zone of the oven in the prior art

Method used

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  • Baking system in LED (Light Emitting Diode) packaging
  • Baking system in LED (Light Emitting Diode) packaging

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specific Embodiment 1

[0036] Specific embodiment one, such as figure 1 As shown, a baking system in LED packaging includes a controller, an oven, a transmission device, and several temperature sensors. The oven includes multiple temperature zones, and a temperature sensor is arranged in each temperature zone. The controller They are respectively connected to the oven, the transmission device, and several temperature sensors. A heat insulation device is provided between two adjacent temperature zones of the oven. Taking the first temperature zone 1 and the second temperature zone 2 as examples, the first temperature zone A heat insulation device 3 is set between zone 1 and the second temperature zone 2, and a first heating plate 4 and a second heating plate 5 are respectively set on both sides of the heat insulation device 3, wherein the first heating plate 4 is located in the first temperature zone 1 , the second heating plate 5 is located in the second temperature zone 2 .

[0037] The transmissi...

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Abstract

The invention discloses a baking system in LED (Light Emitting Diode) packaging. The baking system in the LED packaging comprises a controller, an oven, a transmission device and a plurality of temperature sensors; the oven comprises a plurality of sections of temperature zones; every temperature zone is provided with the temperature sensor; the controller is respectively connected with the oven, the transmission device and the plurality of temperature sensors; a thermal insulation device is arranged between the adjacent two temperature zones of the oven; bilateral sides of the thermal insulation device are provided with heating plates being identical to the temperature zone. According to the baking system in the LED packaging, the thermal insulation device is arranged between every two adjacent temperature zones, the difference between the actual temperature and the set temperature of every temperature zone is small, and the temperature in every temperature zone is uniform.

Description

technical field [0001] The invention belongs to the field of LED applications, and in particular relates to a baking system in LED packaging. Background technique [0002] The LED optoelectronic industry is an emerging sunrise industry with the characteristics of energy saving and environmental protection, especially the low-carbon emission reduction effect of the Copenhagen Global Climate Conference in December 2009, which will make the LED optoelectronic industry more in line with our country's energy and carbon reduction strategies. And gaining more industrial support and market demand has become a beautiful industrial development landscape. The LED industry chain is generally divided into upper, middle and lower reaches, namely LED epitaxial chips, LED packaging and LED applications. As the link between the past and the future in the LED industry chain, the LED packaging industry plays an incomparably important role in the entire industry chain. LED devices are widely ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48
CPCH01L33/48H01L33/005H01L2933/0033
Inventor 时国坚吴俨张军孙继通陈晨范效彰
Owner WUXI WISEN INNOVATION TECH
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