Method and system for improving separation efficiency of LED chips

A technology of LED chips and chips, applied in the fields of sorting, electrical components, semiconductor/solid-state device manufacturing, etc., can solve the waste of manpower and material resources, rearrangement operations, adverse effects on yield yield, impact on sorting efficiency and chip yield, etc. problems, to achieve the effect of reducing the time for picking and distributing Bins, reducing the waste of suction and removal, and improving operability and feasibility.

Active Publication Date: 2015-03-11
XIANGNENG HUALEI OPTOELECTRONICS
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

Scattered Bin affects sorting efficiency and chip yield to a considerable extent
[0004] In actual operation, limited by customer demand, blue film and release paper cost factors, the square chips of each specification chip generally set a minimum number of warehousing (for example, W12A chips, the minimum number of warehousing 500- 1000 pieces, if set to 50 pieces, the value of the release paper and blue film will be almost equal to or higher than the value of the chip; some customers have specified the minimum number of square pieces in the warehouse in order to avoid frequent loading and unloading operations, etc.), cannot The square chips that meet the minimum number of warehousing will be sucked out or rearranged as B products after the final production of the order is finished. On the one hand, it will have a negative impact on the yield and yield rate, and on the other hand, it will require more waste manpower and material resources for rearrangement operation

Method used

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  • Method and system for improving separation efficiency of LED chips
  • Method and system for improving separation efficiency of LED chips
  • Method and system for improving separation efficiency of LED chips

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] This embodiment provides a method for improving LED chip sorting efficiency, comprising the following steps:

[0049] Step 201 collects batches of chips that require data processing;

[0050] Step 202 classifies the data of the chips under the same condition. Here, the classification refers to classifying into the same Bin number according to the photoelectric characteristic parameters of the chip. After classification, each chip in each chip has a corresponding Bin category, the Bin category distribution of the classified chips is in a normal distribution state.

[0051] It should be noted that the classification of Bin categories is based on the specific optoelectronic characteristics of the chip, such as wavelength, brightness, operating voltage, etc., according to the requirements of sub-BIN to divide the number of divisions of each optoelectronic characteristic, and then according to the law of arrangement and combination, multiply each number to get the total Acc...

Embodiment 2

[0069] Below, in conjunction with the attached drawings, the present invention will be described with the production order of 34B specifications of 50 chips produced by Xiangneng Hualei Optoelectronics Co., Ltd.:

[0070] 1) Carry out centralized point measurement on the 50 pieces and transfer them to the same condition table, and get the corresponding resorting data after the AOI inspection.

[0071] 2) Perform data processing on the resorting data, and set the minimum number of warehousing to 50. Due to the need for subsequent visual inspection, it may result in insufficient number of warehousing after suction, so the minimum number of warehousing is set during actual operation It is 55 pieces, if the number is not enough, it will be transferred to product B. After the processing, the result program interface is as follows Figure 3a and Figure 3b shown.

[0072] Respectively Figure 3a and Figure 3b The data in represents the meaning for explanation:

[0073] The min...

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Abstract

The invention discloses a method and a system for improving separation efficiency of LED chips. The method includes the following steps: collecting batch chips which needs for data processing; classifying the chips in the same conditions, wherein each chip core of every chip has a corresponding Bin category; calculating the number of chip cores corresponding to each Bin category of every chip and summing the chip core of the chips to a total number, and comparing the total number with a preset minimum inventory number, and confirming the Bin number of each chip core according to the comparison results; placing each chip on a corresponding separating machine to separate and process. The invention also provides a system for improving separation efficiency of LED chips. The method and the system can reduce the time of separating scattered Bin, and avoid the small square from reorder operations or suction operation, thus without a lot of manpower for statistical analysis.

Description

technical field [0001] The invention relates to the field of sorting LED chips, in particular to a method and system for improving the sorting efficiency of LED chips. Background technique [0002] At present, when most customers receive square chips, in order to reduce the operation of loading and unloading chips from the die-bonding equipment, they often limit the minimum number of square chips to the chip supplier, so as to avoid receiving too few square chips and increase The number of loading and unloading affects production efficiency. In order to meet customer needs, when chip manufacturers operate batches of wafers with a small number of chips, there are mainly two types of sorting operations. speed, but this will have a negative impact on the yield loss of the chip; the second category is to select chips with a certain number or less and select them into unlimited specifications. Although it will not affect the loss of yield, it will affect the final yield. make a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67
CPCB07C5/34H01L21/67155H01L21/67271H01L21/67294
Inventor 陈小雪王红锋彭超
Owner XIANGNENG HUALEI OPTOELECTRONICS
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