Heat conductor with ultra-thin flat plate type capillary structure

Abstract

The invention provides a heat conductor with an ultra-thin flat plate type capillary structure. The heat conductor comprises a flat plate type hollow shell and the capillary structure, wherein the capillary structure is arranged in the shell and is in contact with the inner wall of the shell, the capillary structure is a thin plate type body and is provided with a flat surface and an extrusion surface which is opposite to the flat surface, the flat surface is attached to the inner wall of the shell, the extrusion surface is provided with a plurality of long narrow concave surfaces which are arranged at intervals, a steam flow passage is respectively formed in the shell by each concave surface, and a long narrow capillary organization communication area is formed between all concave surfaces and the flat surface of the capillary structure. According to the heat conductor with the ultra-thin flat plate type capillary structure, provided by the invention, the thinned capillary structure can be formed on the inner wall of the heat conductor, thus enough space is enabled to be maintained by an air flow passage in an ultra-thin heat conductor for carrying out heat exchange of evaporation and condensation after the heat conductor is pressed into the ultra-thin heat conductor, due to an inner supporting structure which is maximum in capillary surface area and truncation transmission surface and is better in strength, a heat tube does not easily concave, the contact heat resistance is smaller, and the purpose of enabling the heat conductor to be ultra-thin can be achieved.

Description

technical field [0001] The invention relates to a thinned heat pipe, especially a heat conductor with an ultra-thin flat capillary structure. Background technique [0002] By the way, since many 3C electronic products today are designed to be light, thin, short, and small, the heat pipes used as internal heat dissipation or heat conduction also need to be thinned, so that they are like ultra-thin heat pipes (thickness is about 1.5mm or less). born. [0003] However, since the thickness of the ultra-thin heat pipe needs to be thinned, the capillary structure inside the heat pipe is also thinner in thickness, otherwise it is impossible to form an airflow channel with enough space in the heat pipe. However, the capillary structure that is too thin cannot be filled in the gap between the mandrel and the heat pipe wall in the manufacturing process, because the gap is relatively small, and the resistance generated when the metal powder is filled is large, so it cannot be processe...

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Problems solved by technology

[0003] However, since the thickness of the ultra-thin heat pipe needs to be thinned, the capillary structure inside it is also thinner in thickness, otherwise it will not be possible to form an airflow channel with sufficient space in the heat pipe

However, the capillary structure that is too thin cannot be filled in the gap between the mandrel and the heat pipe wall in the manufacturing process, because the gap is relatively small, and the resistance generated when the metal powder is filled is large, so it cannot be processed.

Therefore, in the past, the powder capillary structure in the ultra-thin heat pipe was only formed in a part of the heat pipe and was not thinned. Therefore, the powder capillary structure of the conventional ultra-thin heat pipe is not easy to fill the sectional surface of the ultra-thin heat pipe, and the capillary structure cannot be good. Evaporating and condensing surface and cut-off transmission surface, at the same time, cannot maintain enough steam channels, and the internal support structure with weak strength makes the heat pipe easy to sag and has a large contact thermal resistance, so it will not be able to further improve its heat transfer efficiency

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